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Vi TECHNOLOGY to exhibit advanced 3D inspection solutions at NEPCON China

Saint-Egrève, France Vi TECHNOLOGY, a leading provider of 3D inspection solutions for PCB assembly and a member of Mycronic Group, today announced that its products will be showcased at NEPCON China, scheduled to take place April 24-26, 2018 at the Shanghai World EXPO Exhibition & Convention Center.

The awarded PI Series 3D SPI offers new horizons with programming-free software and unprecedented accuracy for small pads. The PI Series offers the only inspection systems that program automatically.  The series has been recognized by the industry as the most innovative SPI product since the introduction of Moiré systems. With 360° digital Moiré technology, the PI Series offers a unique extra-large 3D image for unprecedented review interface and outstanding accuracy. 

The 5K3D is a new patented 3D AOI combination that offers complete defect coverage with high precision metrology. The 5K3D is a 100 percent 3D AOI, it offers a 25 mm range of z-measurement, without compromising high accuracy and speed. 

Vi TECHNOLOGY’s Sigma Line module offers a real-time combination of 3D SPI and 3D AOI inspection measurements. By considering all inspection systems as one tool, the results is a new way to optimize the SMT process and converge to the zero defect line. Also, it is the prerequisite to transform large volumes of data into actionable data. 

Visitors interested in the complete range of state-of-the art 3D inspection technology are welcome to visit Vi TECHNOLOGY in the Mycronic booth 1G25. Vi TECHNOLOGY also will have equipment on display with the following partners: WKK (booth 1H30) will display PI Series 3D SPI and 5K 3D AOI, AmericanTec (booth 1H43) will showcase the PI Series 3D SPI and FTCL (booth 1H35) will demonstrate the 5K AOI. 

For more information about Vi TECHNOLOGY, visit www.vitechnology.com.

 
 
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