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Archive >  March 2018 Issue >  Hi-Tech Events > 

IMAPS Prepares 14th Annual Device Packaging Conference

Research Triangle Park, NC — The 14th annual Device Packaging Conference (DPC) 2018 is planned for March 5 to 8, at the We-Ko-Pa Resort and Conference Center in Fountain Hills, Arizona. This international event is organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
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NEPCON China Focuses on the "Dream" Smart Factory

Shanghai, China — This year's theme at NEPCON China 2018 is the "dream" factory of smart electronics manufacturing. In its 28th year, the exhibition is planned to be held from April 24 to 26, 2018, at the Shanghai World EXPO Exhibition & Convention Center.
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Registration Now Open for BIOMEDevice Boston

Santa Monica, CA — BIOMEDevice Boston, scheduled to be held April 18 and 19, 2018, at the Boston Convention & Exhibition Center, is designed to connect visitors with more than 4,500 engineers and executives and more than 450 suppliers. Suppliers come from all corners of New England's thriving medtech industry ...
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