CLINTON, NY - Indium Corporation
will feature its Indium3.2HF Solder Paste
at the 14th International Wafer-Level Packaging Conference
(IWLPC 2017—Silicon to Systems), Oct. 24-26, in San Jose, Calif.
Indium Corporation’s Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste specifically formulated for fine feature printing applications (Type 6SG).
Indium3.2HF is formulated to offer consistent, repeatable printing performance combined with a long stencil life. In addition, Indium3.2HF delivers:
• Good response-to-pause
• A wide reflow profile window
• Outstanding slump resistance
• Excellent wetting capability
• Superior fine-pitch soldering ability
From water-soluble solder pastes to ultra-low residue, no-clean fluxes, Indium Corporation has an industry-proven portfolio of products that meet the current and evolving challenges encountered in fine-pitch SiP applications.
For more information on Indium Corporation’s materials for SiP or Indium3.2HF Solder Paste, go to www.indium.com/SiP
or visit Indium Corporation’s booth 39.
For more information about Indium Corporation, visit www.indium.com
or email firstname.lastname@example.org
. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium