HANOVER, GERMANY - Viscom is pleased to announce plans to exhibit the 3D AOI system S3088 ultra gold and 3088 basic at SMTA Guadalajara Expo & Tech Forum, scheduled to take place Oct. 18-19, 2017 at Hotel Riu Guadalajara. Viscom will showcase its latest high-performance 3D AOI and SPI systems – S3088 series – along with a number of exciting new 3D imaging features and the new Viscom Open Interface 4.0.
The new S3088 ultra gold with XMplus
Showcasing its latest innovations Viscom will present the high-end 3D AOI system S3088 ultra gold which is the performance champion of Viscom’s successful S3088 ultra family. The central innovation of the S3088 ultra gold is the 3D camera module XMplus with 8 angled-view cameras and one orthogonal camera. It enables the system to reach image data rates of up to 3.6 gigapixels per second. Furthermore, the S3088 ultra gold boasts a 50 mm x 50 mm (2" x 2") field of view which allows for an unprecedented inspection speed of up to 65 cm2/s.
Exciting new 3D imaging features
Along with the high-performance hardware Viscom delivers exciting new software features that allow for the most precise and comprehensive 3D image creation. With the unique 360View capability, side views of electronic components can be rendered in extraordinarily realistic detail.
In addition the all new 3D solder joint measurement capability has been added to the performance spectrum of the Viscom AOI range to even further improve evaluation results, reduce false calls and to increase overall production efficiency.
Viscom Open Interface 4.0.
With the Viscom Quality Uplink and Viscom statistical process control (SPC), users of inspection systems like the S3088 SPI, S3088 ultra gold or X7056RS have tools at hand that provide versatile data linkages and evaluation options. Now, with the new Viscom Open Interface 4.0 feature, a decisive step further has been taken: Information can now be merged independently of the manufacturer.
S3088 SPI – Highest speed and precision
The award-winning S3088 SPI inspection system combines the advantages of market-leading Viscom AOI systems with powerful 3D SPI sensor technology and inspects the solder paste deposits with the highest possible speed and precision. Even the most demanding assemblies with CSPs or micro BGAs and pad sizes of 01005 are reliably inspected.
For additional information: www.viscom.com