Somerset, NJ – September 11, 2017 – Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be hosting full day seminars on “Next Generation Soldering Technology” on September 19 at Eastin Hotel Penang in Malaysia and September 21 at Miracle Grand Convention Hotel Bangkok in Thailand.
Alpha Assembly Solutions, a part of the MacDermid Performance Solutions group of businesses, will share ideas and updates on an array of topics including low temperature soldering and void control in segments covering the PC, Mobile and Automotive space.
In the early part of the seminar, a representative from iNEMI will discuss the solder alloy industry’s recent efforts to take low temperature soldering reliability to the next level. Subsequently, Alpha will provide an overview and history of low temperature soldering technology and how these efforts have resulted in a game changing low temperature material, “ALPHA® OM-550 HRL1 Solder Paste”, coming soon to the market.
Following which, the seminar will wrap up with electronics developments in the Automotive industry and options for void management in typical BTC components, for seminar participants to stay up-to-date on these areas.
“These seminars represent Alpha Assembly Solutions’ efforts to engage participants in a forum that facilitates a free exchange of ideas and techniques to benefit the industry as a whole”, said Phua Teo Leng, Regional Product Manager for Solder Paste.
For more information on Alpha’s vast product offering and capabilities, visit AlphaAssembly.com