Saturday, July 21, 2018
VOLUME - NUMBER
Advertisements
Home/Current Issue >  Industry Articles >  Test and Automation > 

Bubble-Free Potting of High-Voltage Capacitors for Medical Engineering


An increasing demand for high-voltage capacitors in medical devices is causing manufacturers, such as Fischer & Tausche Capacitors (FTCAP), to reexamine their potting processes.

Read More

Building Fiber Optic Strain Sensors into Metal Components


Conventionally attached to the outside of a component or device, sensors detect and respond to external stimuli, controlling the equipment on which they are mounted. Now, it is possible to build sensors into the metal matrix of a piece of equipment with 3D metal printing.

Read More

Expanded ASM and RIT Partnership Delivering Results


One year ago, ASM and Rochester Institute of Technology (RIT) expanded a nearly two-decade-long partnership, installing an advanced SIPLACE SX placement platform and a DEK Horizon 01iX stencil printer at RIT's Center for Electronics Manufacturing and Assembly (CEMA) lab. Since June ...

Read More

Integrating Functional Electronics into 3D Injection-Molded Plastics


A new technology from TactoTek, in-mold structural electronics (IMSE) production, is ridding developers of complex, multi-part electronic assemblies with mechanical buttons and switches. IMSE replaces these devices with single-piece solutions that are thin, light and strong ...

Read More

New Touch Encoder Technology Makes User Experience More Intuitive


Industrial designers are always looking for ways to improve user interface controls by combining functionalities of rotary switches, pushbuttons, trackballs, potentiometers, and touchscreens. In doing so, they can reduce component costs and streamline the user experience. New touch ...

Read More

PLC Security Critical to Today's Automated Factories


PLCs (programmable logic controllers) are user-friendly microprocessor-based specialty computers that carry out control functions, many of which have high levels of complexity. As security concerns grow around factory automation, getting up to speed with the different types of PLC security ...

Read More

Using Self-Programming Software to Accelerate 3D Inspection


Programming inspection systems can be tedious and time-consuming, but much of this manual effort can be eliminated with new self-programming software. Saki Self-Programming (SSP) requires only a few clicks and takes less than 10 minutes to complete a program. This system can program ...

Read More

A Road Map to Successful Thermal Testing


Whether testing one device or millions, the ultimate goals of any thermal testing operation are efficiency, accuracy, and stability. Thermal forcing, clamping, and calibration methods are all variables, but the one common denominator in all test scenarios is the socket. Exatron's new ...

Read More

Beyond Debug: XJTAG for Flash Programming and Board Test


The JTAG standard, first established by the IEEE 27 years ago, defines an electrical and physical method for connecting JTAG-enabled devices on a PCB, or across multiple PCBs. However, JTAG is not a general-purpose bus. The technology behind the interface differs significantly from ...

Read More

Selecting and Optimizing Wet Processing Equipment


Microfabrication operations such as metal lift-off, stripping, etching, plating/coating, cleaning, and die-bonding are typically wet processing procedures. Yet, selecting the equipment to perform those procedures most efficiently and cost-effectively is often not a simple matter. In ...

Read More

Shadow Moiré Measurement Techniques for Discontinuous and Semi-Reflective Surfaces


Flip chip packages are seldom perfectly co-planar; instead, there exists an angle between the die and package substrate, which becomes a critical factor in maintaining product yield and reliability. Point-to-point height measuring quality checks for die tilt can be time-consuming, and ...

Read More

The Benefits and Risks of Copper Pillar Bumped Flip Chips: Part 2


Copper has inherently higher electrical and thermal conductivity than SnPb or SnAg/SnAgCu solders, by a factor of about 25. Higher conductivities reduce current density and temperature within the interconnect, which are the primary drivers for matter flow and electromigration (EM) failures ...

Read More

Using Cell-Aware Scan Diagnosis to Improve Yields


Finding and diagnosing manufacturing defects in a failing device through scan diagnosis has long been a way to improve yields for both high-volume ICs and for new manufacturing processes. Scan diagnosis utilizes a design description, scan test patterns and failure data from a tester ...

Read More
 
 
search login