|CLINTON, NY - Indium Corporation’s Wisdom Qu, assistant technical manager, and Fengying Zhou, research chemist, will present at the SMTA China South Conference Aug. 26-28 in Shenzhen, China.
Wisdom’s presentation, Epoxy Flux – A Low-Cost, High-Reliability Approach to PoP Assembly,
describes how epoxy fluxes combine soldering and reinforcement into one
single process for increased mechanical, thermal, and electrical
reliability with reduced assembly costs.
Fengying will deliver two presentations. Her first presentation, Corrosion Resistance of High-Temperature, Lead-Free BiAgX® Solder Paste, reviews the results of a comparison between BiAgX®,
a drop-in, lead-free solder paste solution for high-temperature
die-attach applications, and Pb5/Sn2.5/Ag and SAC305. She will share the
morphological observations indicating that BiAgX® is more resistant to corrosion than the other two solder alloys.
Fengying’s second presentation, The Effect of Thermal Pad Patterning on QFN Voiding,
will explain how and why voiding at the QFN assembly can be suppressed
by improving venting accessibility on the thermal pads with the use of a
solder mask dividing strip.
SMTA China South is a
conference that is held in conjunction with NEPCON South China 2014.
This conference addresses the industry’s most pressing issues in
electronics assembly, advanced packaging, and lead-free electronics
assembly, including practical skills development and emerging
technologies. For information, visit www.nepconsouthchina.com.
is an SMTA-Certified Process Engineer with more than nine years of
experience in surface mount technology. Indium Corporation recognized
her knowledge and expertise in 2007 with the prestigious Silver Quill
Award for Best Technical Paper/Presentation of the year. She holds a
degree in mathematics from Hubei Radio and Television University in
Fengying has been a research
chemist for the Research and Development department since 2010. She is
responsible for the development of SMT assembly materials, with emphasis
on developing additives to enhance the thermal reliability of lead-free
solder pastes. She holds a bachelor’s degree in applied chemistry and a
master’s degree in inorganic chemistry from Suzhou University.
For more information about Indium Corporation, visit www.indium.com or email email@example.com.