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ASMPT’s new SMT Solutions Segment debuts first-time joint booth
 
A first: SIPLACE and DEK teams of ASMPT’s new SMT Solutions Segment display their best-in-class printing and placement solutions at a joint booth at Nepcon Shenzhen 2014.
MUNICH, GERMANY - Almost two months after ASM Pacific Technologies finalized the acquisition of printing specialist DEK, the newly created SMT Solutions Segment of ASMPT will – for the first time – showcase its best-in-class SMT placement and printing solutions at Nepcon Shenzhen 2014, August 26 – 28. At the Shenzhen Convention & Exhibition Center, booth C2-1E80, the SIPLACE team of ASM Assembly Systems confirms its status as an innovation leader with exhibits such as the SIPLACE X4i S, which is the fastest placement machine in the market and boasts a performance up to 150,000 cph with the new SIPLACE SpeedStar CP20 P placement head. Focus is also on the current industry trend towards ever-shrinking components with a live demonstration of 03015 placement. For fully automated production solutions, the SIPLACE software experts showcase intelligent tools like SIPLACE Material Manager and SIPLACE Material Setup Assistant for perfectly organizing materials from material income to placement. The new SIPLACE sister DEK brings its best-in-class printing solution DEK Horizon 03iX as well as the DEK Print Lab Solutions Center & 2020 Vision and DEK Productivity Tools.


The Nepcon Shenzhen trade show marks the first time the new SMT Solutions Segment’s two divisions – the SIPLACE Placement Solutions Division and the DEK Printing Solutions Division – present their latest SMT innovations at one joint booth. Günter Lauber, CEO of ASMPT’s SMT Solutions Segment: “This joint booth is an exciting debut for the SIPLACE and DEK teams. Even though the acquisition of DEK is still relatively fresh, we can definitely show that we are already working together as one team. SIPLACE and DEK are innovations leader in their respective fields – their best-in-class solutions obviously combine well.”

SIPLACE: #1 in Speed, for Smallest Components and in Material Management

In terms of product innovations, the SIPLACE team highlights three specific superlatives from its product portfolio at Nepcon Shenzhen 2014. The four-gantry placement platform SIPLACE X4i S holds the current record for highest performance values: equipped with four of the new high-speed placement heads SIPLACE SpeedStar CP20 P, it reaches up to 150,000 components per hour. Additionally, visitors can witness never-before-seen, high-quality processing of the smallest 03015 components live at the ASM Assembly Systems booth.

Boasting the most comprehensive software portfolio in the market and therefore catering to the industry trend of smart automated factories, SIPLACE highlights its intelligent suite for Material Management, apart from other software tools

Together #1 – a first step towards innovative process solutions

With SIPLACE and DEK the SMT Solutions Segment now has two well-known, innovative brands that have delivered best-in-class solutions for many years and will continue to do so in the future. “It is well-known in the electronics industry that the greatest process improvement potential lays in integrating the SMD processes along the production line. With the acquisition of DEK, we will focus not only on growth and innovative best-in-class solutions but also on developing a new generation of SMT line solutions that deliver more efficiency and process reliability through more effective integration of the printing, inspection and placement processes. Our teams are already successfully working together, and as two innovation leaders, we are growing into one team. I believe that the ASM booth will be impressive proof of that,” said Lauber.

Find out more about Nepcon Shenzhen 2014, SIPLACE and DEK at www.siplace.com/nepcon2014.

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