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Monday, May 22, 2017
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PCB and Test
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PCB and Production
Assembly and Production
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PCB and Manufacturing
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Test and Measurement
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Production and Packaging
Production and Packaging
A Practical Guide to Managing Material Cost
By Ben Khoshnood, President, Inovaxe Corp.
Many years ago, I ran a high-mix, low- to mid-volume EMS business. Like everyone else, surprise shortages were driving the million dollar SMT lines to screeching halts. Often the familiar sound of "cha-ching" would stop, and everyone scrambled to find the part that was supposed to be ...
Combining Thin-Layer and PCB Technology in Microelectronics
By Ursula Gore, Cicor Americas, Inc.
The boundaries between thin-layer and printed circuit technology in microelectronics are becoming increasingly blurred. At the same time, the demand for thin-layer circuits and miniaturized components continues to grow. Cicor, an industrial provider of advanced microelectronics, uses ...
Embedded Components: The New Frontier for PCBs
By Walter Gueili, Seica S.p.A., Strambino, Italy
Less is more. At least in the size of the printed circuits for most devices we make today. As the race to make things smaller continues, manufacturers have begun to build previously surface-mounted components into the layers of a PCB. Over the last few years, embedding components in ...
Faster Product Cycles: Can Your Supply Chain Keep Up?
By Stefan Merlau, Global Product Manager SMT, Heraeus Electronics
There is a popular adage when it comes to business: cheap, fast, or good — pick two. The electronics market is demanding ever-faster development, greater performance and cost-efficiency from every product. To better deliver in all three of these areas, solid collaboration and commitment ...
Mission-Critical Applications: Qual-Pro Advanced 3D Inspection
By Steve Wongsonvanee, Pemtron Technology and Michael McCallion, Qual-Pro
America's space program is moving ahead on several fronts in an effort to rid NASA of its dependence on Russian Soyez spacecraft. An important part of this program is the Boeing Starliner, a spacecraft that will ultimately do the kinds of jobs that had been handled by the now-retired ...
New Jetting Technology for Fluid Dispensing
By Garrett Wong and Roberta Foster-Smith, Nordson ASYMTEK
In jetting, fluid is rapidly ejected through a nozzle and uses momentum to break free in discrete droplets. Jetting has evolved to become a standard production process in the industry, and now accommodates a wide variety of fluids and applications. Everything from more intricate, emerging ...
Predicting Assembly Yields by Viscosity Measurement
Mitch Holtzer, Global Director of Customer Technical Support, Alpha Assembly Solutions
According to dozens of published surface-mount process studies, up to 80 percent of defects occur when solder paste is stencil-printed onto a bare board. Many of the problems can be traced back to the interaction of the process equipment and the flow quality of the solder paste. In ...
Saki Celebrates Over Two Decades of Technology and Expansion
By Michael Skinner, Assistant Editor
"When we began, AOI was a luxury", says Jodie Akiyama, CEO of Saki. "Now it's a necessity." In 1994, Sakie (Jodie) and Yoshihiro Akiyama founded Saki Corporation in Japan. At the time, the electronics inspection market was dominated by large corporations that offered AOI technology, but ...
Sharpening the Competitive Edge: Lenze Americas and Samsung
By Don Lockard, Yankee Soldering,Vince Parente and Nick Siciliano, Lenze Americas
In the early 1990s, PCB manufacturing floated overseas, lured by cheap labor and free trade. Now, many plants in the U.S. using the same equipment and paying more for labor, produce little by comparison. The industry in the U.S. consists mainly of those PCB assemblies that are not ...
How Clean Is Clean Enough for Reliability?
By Mike Bixenman, DBA; David Lober, KYZEN; Mark McMeen and Jason Tynes, STI Electronics, Inc.
Dirt and residues trapped under bottom circuit terminations can affect performance due to shorter distances between conductors, higher pin out devices in smaller footprints, higher electrical field densities, and various environmental factors. No universal test method can ensure proper ...
Reflow in Today's High-Mix/High-Volume Production Environment
By Bjorn Dahle, President, KIC, San Diego, CA
Many printed-circuit-board (PCB) production lines working in surface-mount-technology (SMT) markets in the US and Europe can be described as high-mix, low-to-medium-volume lines. Many of these lines experience more downtime than production time, creating a serious challenge: how to ...
Reflow Soldering: With or Without Vacuum?
By Paul Wild, Research & Development, Rehm Thermal Systems GmbH
Vacuum is an emptiness that can be fulfilling, especially for electronics production and reflow soldering. It was when Galileo Galilei (1564-1641) posed the question of the existence of absolute emptiness (from the Roman latitudinus vacuus) that the concept was first brought from the ...
Tester Aims for Zero Defects When Manufacturing PCBs
By Peter van den Eijnden, JTAG Technologies, Eindhoven, The Netherlands
Zero defects for a manufacturer means never delivering a defective product to a customer. Manufacturers of printed circuit boards (PCBs) are doing absolutely everything in their power to make this happen — knowing full well that they cannot possibly achieve 100 percent zero defects ...
Absolutely the Best Way to Weld Tin-Coated and Oxidized Wires and Terminals
By Janet Devine, President, Sonobond Ultrasonics
Electronic applications that must face high-temperature, high-humidity, and other environmentally challenging conditions can benefit from welding the tin-coated wires and terminals essential to those applications. Fortunately, ultrasonic welding technology from Sonobond provides an effective and reliable means of welding these wires and terminals. Tin-coated copper wiring is preferred for marine motors and electronics, appliances, solar panel wiring, and some automotive applications, and Sonobond's ultrasonic systems can achieve consistently reliable welds that remain highly conductive without sacrificing the protective properties of the tin coating.
Expand Capacity and Business with A Single, Modular Mounter
By Michael T. McGrath
It isn't every day that a production machine can become something more, that it can open doors to new growth possibilities. Nor is it often that it leads to the founding of a sister company with its own original-equipment-manufacturer (OEM) product line, with all the promise and possibilities ...
Precise Solder Dispensing Aids High-Throughput Microdevice Packaging Applications
By Hanzhuang Liang, Linh Rolland, Floriana Suriawidjaja, Mani Ahmadi, and Heakyoung Park, Nordson ASYMTEK, Carlsbad, CA
Advanced microdevice packaging has established new levels of required performance for supplier industries for speed, precision, and flexibility. A high-precision and high-throughput solder paste dispensing process has been developed to fill the gap between novel packaging design and ...
Production Testing Using Flying Probe Systems
By Paul Bennett, Western Sales Manager, and Karim Dehkordi, Director, Global Customer Support & Services, Acculogic Ltd.
Since the mid 1990s, moving-probe in-circuit test systems have been widely used for electronic structural testing of prototypes and new product introduction of printed-circuit-board assemblies (PCBAs). For higher-volume and faster production testing, in-circuit test (ICT) or manufacturing ...
Screen Printers Support CEM's Oversized Production Capabilities
By the Staff of Silicon Mountain Contract Services
Based on the premise that contract electronic manufacturers (CEMs) located in the United States could provide customer satisfaction without those customers going overseas, Silicon Mountain Contract Services has grown steadily over the past 12 years. Founded in 2002 by Kris Townsend ...
Soldering Fine-Pitch THT Components
Gerjan Diepstraten, Vitronics Soltec, Camdenton, MO
As PCB assemblies get smaller and use smaller components and pitches, the result is less space on PCBs but with increased functionality. Roadmaps from IPC (www.ipc.org) and iNemi (www.inemi.org) suggest a minimum pitch of 40mils (1.00mm) in the near future. Because of the limitations ...
Risky Components Removed by Ultrasound
By Tom Adams, Consultant, Sonoscan, Inc., Elk Grove Village IL
Many potential failures of electronic systems in the field are avoided each year because components likely to fail were removed from the production stream before being mounted on a printed-circuit board (PCB). These ill-fated components were identified by acoustic microimaging, which ...
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