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Friday, December 15, 2017
VOLUME - NUMBER
PCB and AUTOMATION
Test and Automation
PCB and Test
Test and Assembly
SMT and Assembly
Assembly and Production
PCB and Production
Assembly and Production
PCB and Assembly
Assembly and Packaging
PCB and Manufacturing
SMT and Production
Test and Measurement
Components and Distribution
Production and Packaging
Production and Packaging
Ultrasonic Piezo Transducers for Smart Sensors
By Frank Moeller and Stefan Vorndran, PI (Physik Instrumente)
Piezoelectric transducers are based on electro-ceramic materials that convert mechanical power into electrical power and vice versa. There are two effects. First, when a force is applied, an electric charge is generated (direct piezo effect). Then, when an electric field is applied ...
Spectrum Ups the Sensitivity of Modular Digitizers
By Oliver Rovini, Technical Director, Spectrum Instrumentation
Spectrum Instrumentation has added an option, M4i.22xx-ir40m, to its successful, high-speed 22xx series of digitizer products that increases their sensitivity and absolute resolution for low amplitude signals in the ±40 mV up to ±0.5V range. The current products are optimized ...
Progressive Cavity Pumps Enable Vital Precision and Repeatability
By Can La, Product Manager, Techcon Systems
Up until roughly five years ago, operators of manual and automated dispensing lines had little ability to achieve highly-accurate, consistent application of adhesives, epoxies and other fluids. This was especially difficult for small depositions, when working with viscous materials ...
Managing Thermal Energy with a Finely-Tuned Adhesive
By Laurie Gibbons, Business Development Manager, Permabond
Heat, vibration, moisture, and dust can all wreak havoc in electrical systems. With the miniaturization of components, heat or thermal management becomes an even more critical factor in the design process. Managing heat in processing, heat dissipation, and thermal expansion and contraction ...
Industry Voices: A Breakout Year for the IoM
By Michael Skinner, Associate Editor
From every corner of the electronics manufacturing industry we are hearing about the Internet of Manufacturing (IoM) or one of its various appellations, including Industry 4.0 and the Industrial Internet of Things (IIoT). This trend is changing rows of discrete machines into efficient ...
Breaking Records: Koh Young Delivers 10,000th Inspection System
By Jenny Yuh, Marketing Assistant, Koh Young Technology
Koh Young Technology, one of the fastest-growing 3D inspection systems providers worldwide, recently delivered its 10,000th inspection system, a Zenith AOI machine, to a large Chinese automotive supplier. The Zenith system is designed to measure the true profilometric shape of components ...
Benchmarking RFID Readers for Maximum Tag Performance
By Klaus Schoeke, VP of Technical Sales, FEIG Electronics
From trains and warehouses to hospitals and libraries, RFID systems are delivering greater efficiency, security and productivity to workplaces around the world. With the growing popularity of products and solutions that offer the convenient connectivity made possible by the Internet ...
Sharpening the Competitive Edge: Lenze Americas and Samsung
By Don Lockard, Yankee Soldering,Vince Parente and Nick Siciliano, Lenze Americas
In the early 1990s, PCB manufacturing floated overseas, lured by cheap labor and free trade. Now, many plants in the U.S. using the same equipment and paying more for labor, produce little by comparison. The industry in the U.S. consists mainly of those PCB assemblies that are not ...
Saki Celebrates Over Two Decades of Technology and Expansion
By Michael Skinner, Assistant Editor
"When we began, AOI was a luxury", says Jodie Akiyama, CEO of Saki. "Now it's a necessity." In 1994, Sakie (Jodie) and Yoshihiro Akiyama founded Saki Corporation in Japan. At the time, the electronics inspection market was dominated by large corporations that offered AOI technology, but ...
Predicting Assembly Yields by Viscosity Measurement
Mitch Holtzer, Global Director of Customer Technical Support, Alpha Assembly Solutions
According to dozens of published surface-mount process studies, up to 80 percent of defects occur when solder paste is stencil-printed onto a bare board. Many of the problems can be traced back to the interaction of the process equipment and the flow quality of the solder paste. In ...
New Jetting Technology for Fluid Dispensing
By Garrett Wong and Roberta Foster-Smith, Nordson ASYMTEK
In jetting, fluid is rapidly ejected through a nozzle and uses momentum to break free in discrete droplets. Jetting has evolved to become a standard production process in the industry, and now accommodates a wide variety of fluids and applications. Everything from more intricate, emerging ...
Mission-Critical Applications: Qual-Pro Advanced 3D Inspection
By Steve Wongsonvanee, Pemtron Technology and Michael McCallion, Qual-Pro
America's space program is moving ahead on several fronts in an effort to rid NASA of its dependence on Russian Soyez spacecraft. An important part of this program is the Boeing Starliner, a spacecraft that will ultimately do the kinds of jobs that had been handled by the now-retired ...
Faster Product Cycles: Can Your Supply Chain Keep Up?
By Stefan Merlau, Global Product Manager SMT, Heraeus Electronics
There is a popular adage when it comes to business: cheap, fast, or good — pick two. The electronics market is demanding ever-faster development, greater performance and cost-efficiency from every product. To better deliver in all three of these areas, solid collaboration and commitment ...
Embedded Components: The New Frontier for PCBs
By Walter Gueili, Seica S.p.A., Strambino, Italy
Less is more. At least in the size of the printed circuits for most devices we make today. As the race to make things smaller continues, manufacturers have begun to build previously surface-mounted components into the layers of a PCB. Over the last few years, embedding components in ...
Combining Thin-Layer and PCB Technology in Microelectronics
By Ursula Gore, Cicor Americas, Inc.
The boundaries between thin-layer and printed circuit technology in microelectronics are becoming increasingly blurred. At the same time, the demand for thin-layer circuits and miniaturized components continues to grow. Cicor, an industrial provider of advanced microelectronics, uses ...
A Practical Guide to Managing Material Cost
By Ben Khoshnood, President, Inovaxe Corp.
Many years ago, I ran a high-mix, low- to mid-volume EMS business. Like everyone else, surprise shortages were driving the million dollar SMT lines to screeching halts. Often the familiar sound of "cha-ching" would stop, and everyone scrambled to find the part that was supposed to be ...
Tester Aims for Zero Defects When Manufacturing PCBs
By Peter van den Eijnden, JTAG Technologies, Eindhoven, The Netherlands
Zero defects for a manufacturer means never delivering a defective product to a customer. Manufacturers of printed circuit boards (PCBs) are doing absolutely everything in their power to make this happen — knowing full well that they cannot possibly achieve 100 percent zero defects ...
Reflow Soldering: With or Without Vacuum?
By Paul Wild, Research & Development, Rehm Thermal Systems GmbH
Vacuum is an emptiness that can be fulfilling, especially for electronics production and reflow soldering. It was when Galileo Galilei (1564-1641) posed the question of the existence of absolute emptiness (from the Roman latitudinus vacuus) that the concept was first brought from the ...
Reflow in Today's High-Mix/High-Volume Production Environment
By Bjorn Dahle, President, KIC, San Diego, CA
Many printed-circuit-board (PCB) production lines working in surface-mount-technology (SMT) markets in the US and Europe can be described as high-mix, low-to-medium-volume lines. Many of these lines experience more downtime than production time, creating a serious challenge: how to ...
How Clean Is Clean Enough for Reliability?
By Mike Bixenman, DBA; David Lober, KYZEN; Mark McMeen and Jason Tynes, STI Electronics, Inc.
Dirt and residues trapped under bottom circuit terminations can affect performance due to shorter distances between conductors, higher pin out devices in smaller footprints, higher electrical field densities, and various environmental factors. No universal test method can ensure proper ...
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