Simi Valley, CA — Hirose has developed the DF63 connector, a robust wire-to-board connector that combines small size with high-current capacity and high reliability. The connector has a 3.96mm pitch, provides a high current rating of up to 15 amps, and is suitable for use with #16 to #18 AWG wire. Current capacity varies with pin count and wire size. This compact DF63 Series connector results in 30 percent less occupied PC board space compared to other connectors.
|High current connector. |
The rugged crimp contact system with multi-contact points increases reliability and performance. The clear tactile and audible "click" during engagement ensures complete mating. The locking structure provides strong retention with a minimum locking strength of 35N for demanding applications. The center position lock system and keying options allow side-by-side mounting to reduce overall package size. The DF63 also uses individual contact silos which make the connector finger-safe in operation.
This series is available in straight, right-angle and in-line variations ranging from 1 to 6 contact positions (right-angle and in-line variation being available in late 2014). The DF63 is also suitable for potting or resin sealing up to a 5mm high.
The small size and high durability of the DF63 Series wire-to-board connector makes it well-suited for a wide range of applications including industrial machinery, industrial robotics, medical devices, networking equipment/servers, smart meters, home electronics, white goods, office equipment and gaming equipment. The DF63 Series is RoHS compliant and UL and TUV certified. With an operating temperature range of -35 to +105°C, the DF63 limits contact resistance to less than 10mΩ maximum, and has an insulation resistance of 1000MΩ minimum at 500VDC.
Contact: Hirose Electric U.S.A., Inc., 2688 Westhills Court, Simi Valley, CA 93065 805-522-7958 fax: 805-522-3217 Web: http://www.hirose.com/us