Tuesday, February 21, 2017
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Panasonic Debuts Flip Chip Bonder
Flip chip bonder.
Rolling Meadows, IL — Panasonic Factory Solutions Company of America has introduced a process-flexible flip-chip bonder as part of its high-speed, low-cost manufacturing solutions for highly advanced devices.

Called the MDP-300, the company's latest bonder combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint solution. It includes a synchronous head motion that enables the bond head and the dispenser to work in parallel. This process immediately increases bond quality and enhances overall throughput.

Supporting up to 300mm (12-in.) wafer substrates, it can even connect to an SMT machine.

Contact: Panasonic Factory Solutions Company of America, 5201 Tollview Dr., Rolling Meadows, IL 60008 847-637-9600 E-mail: PFSAmarketing@us.panasonic.com or

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