Rolling Meadows, IL — Panasonic Factory Solutions Company of America has introduced a process-flexible flip-chip bonder as part of its high-speed, low-cost manufacturing solutions for highly advanced devices.
|Flip chip bonder. |
Called the MDP-300, the company's latest bonder combines flip chip, thermosonic, and thermocompression bonding in a single, small footprint solution. It includes a synchronous head motion that enables the bond head and the dispenser to work in parallel. This process immediately increases bond quality and enhances overall throughput.
Supporting up to 300mm (12-in.) wafer substrates, it can even connect to an SMT machine.
Contact: Panasonic Factory Solutions Company of America, 5201 Tollview Dr., Rolling Meadows, IL 60008 847-637-9600 E-mail: PFSAmarketing@us.panasonic.com or http://www.panasonicfa.com