CLINTON, NY - Indium Corporation’s Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Surface Mount Technology Association’s International Conference and Exhibition (SMTAi) on Monday, September 29 in Rosemont, Ill.
Dr. Lee’s course, Properties and Applications of Low Temperature Solders, discusses the physical, mechanical, and soldering properties and applications of a variety of low temperature solders, with emphasis on lead-free alloys. Low temperature soldering is preferred for a number of special applications, such as heat-sensitive devices, systems that require step-soldering, parts with significant differences in their coefficients of thermal expansion, components exhibiting severe thermal warpage, or products with highly miniaturized design.
SMTA International is an annual technical conference and exhibition on electronics assembly and advanced packaging that draws industry professionals from around the world. For the full SMTAi 2014 schedule, visit www.smta.org/smtai.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com.