NASHVILLE, TN — Kyzen will exhibit MICRONOX® MX2302 Wafer-level Cleaning Solution and AQUANOX® A4638 Advanced Packaging Cleaning Chemistry in booth 1226 at SEMICON Taiwan, which is scheduled to take place at TWTC Nangang Exhibition Hall in Taipei City, Taiwan from September 3-5, 2014.
MICRONOX® MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and microBGA packages. The material has proven effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems. Easy to use, MX2302 has excellent compatibility with all soldering materials, passivation layers (PI, Nitride, Silicon Dioxide, BCB, etc.) and metal layers.
AQUANOX® A4638 was developed to rapidly dissolve water-soluble polar flux residues and exhibits a low surface tension. A4638 is combined with Kyzen’s revolutionary inhibition technology to provide superior material compatibility. An engineered electronic assembly and advanced packaging cleaning agent, this aqueous solution is designed to remove flux residue from flip chip and low clearance components. A4638 is non-hazardous, biodegradable and contains no CFCs or HAPs.
Both MICRONOX® MX2302 and AQUANOX® A4638 are available in 25 and 200 liter (five, and 55 gallon) containers.
Kyzen®, MICRONOX® and AQUANOX® are registered trademarks in the United States and other countries.
For more information, visit www.kyzen.com.