Sunday, August 28, 2016
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FujiPoly Expands Line of Thermal Interface Materials
CARTERET, NJ — Fujipoly’s announces the expansion of its Sarcon® XR-Pe product offering with the availability of a 1.0 mm thick sheet. Sarcon® XR-Pe delivers a remarkable thermal conductivity of 11 W/m°K (ASTM D 5470) with a thermal resistance as low as .06°Cin2/W.

The silicone-based material easily conforms to most CPU and semiconductor shapes with a very low compression force requirement.  This soft-touch characteristic is maintained for applications that require material compression from 30% up to 90%. Additionally, Sarcon® XR-Pe can be used in applications with temperatures ranging from -40 to +150°C. 

This advanced material helps improve semiconductor performance by efficiently transferring unwanted heat to a nearby heat sink. Sarcon XR-Pe is now available in 1.0, 1.5 and 1.5mm thick sheets up to a maximum dimension of 300mm x 200mm.  This material can also be ordered in die-cut form to fit your custom application specifications.

For more information, call (732) 969-0100 or visit us on the Web at http://www.fujipoly.com.

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