902IP is the most recent ZigBee IP release from the ZigBee Alliance to support IPv6-based full wireless mesh networking solution to control low power, low cost devices, such as those for HEMS (Home Energy Management Systems) and ECHONET Lite in the 920MHz frequency band designated by Japan's Ministry of Internal Affairs and Communications (MIC). Integrating a half-watt power amplifier (PA), low noise amplifier (LNA), antenna switch and all impedance matching networks into a single-chip/single-die CMOS device and assembled in a tiny 3x3mm QFN (Quad-Flat Non-Lead) package, the RFX1010 is the ideal RF front-end solution for both 920IP, as well as the emerging IEEE 802.11ah standard based applications.
"By adding RFX1010, RFaxis now offers the industry's most comprehensive and high-performance RF front-end portfolio, at a price point utterly disruptive in the IoT / ZigBee market." said Mike Neshat, chairman and CEO of RFaxis. "RFX1010 is a market-proven product that has passed the most rigorous, industrial-rating qualification by our strategic partners. We have already secured several design-wins with Tier-1 customers in North America and Asia. We applaud the most recent 920IP initiatives by the ZigBee Alliance, which we believe will accelerate the adoption of sub-GHz radio for the nascent HEMS and Smart Home/Smart Energy markets in Japan and the rest of the world."
The RFaxis IoT / M2M RFeIC portfolio now consists of RFX2401C and RFX2411 for 2.4GHz, RFX1010 for sub-GHz (600-900MHz), and RFX5000 for 5 - 6GHz frequency bands. These devices can work with all popular wireless standards including ZigBee, Bluetooth, Bluetooth Low Energy, ANT, 6LoWPAN and other generic ISM or proprietary radios. They provide key RF functions, including the power amplifier (PA), low noise amplifier (LNA), as well as antenna switches that are needed to guarantee robust operating range and high receive sensitivity of any wireless system, even in the harshest RF environment.
Built upon RFaxis' patented single-chip/single-die RFeIC architecture and fabricated in industry-standard bulk CMOS technology, these reliable RFeICs not only simplify RF designs tremendously, they also provide a significant cost reduction compared with traditional GaAs or SiGe based RF front-end solutions. All these RFeICs are available in bare die form, making it possible for wireless module manufacturers to design miniature SiP (System-in-Package) or compact, pre-certified ZigBee / ISM modules. These bare dies are offered at an even lower price than their packaged counterparts which is more welcome news for hardware developers in the IoT/M2M ecosystem.