Monday, December 11, 2017
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Kyzen Brings Advanced Packaging Cleaning Chemistries
Clean BGA bumps is just one positive outcome.
 
Nashville, TN — Kyzen is showcasing its AQUANOX® A4638 Advanced Packaging Cleaning Chemistry and MICRONOX® MX2302 Wafer Level Cleaning Solution.

AQUANOX A4638 removes flux residue from flip chip and low clearance components. It rapidly removes water-soluble polar flux residues and exhibits a low surface tension. Incorporating the company's inhibition technology, A4638 offers exceptional material compatibility and is a non-hazardous, biodegradable aqueous solution containing no CFCs or HAPs.

MICRONOX® MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean and tacky flux from wafer bumps found in flip chip, chip scale and µBGA packages. Effective in ultrasonic, centrifugal and semi-aqueous spray under immersion cleaning systems, MX2302 is compatible with all soldering materials and metal layers. AQUANOX A4638 and MICRONOX MX2302 are available in one, five and 55 gallon ()3.78, 18.9 and 208 liter) containers. In addition, the company offers a full line of precision cleaning chemistries that meet any cleaning challenge.

 

Contact: Kyzen, 430 Harding Industrial Dr., Nashville, TN 37211 800-845-5524 or 615-831-0888 fax: 615-831-0889 E-mail: info@kyzen.com Web:
http://www.kyzen.com


 
 
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