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Monday, September 24, 2018
VOLUME - NUMBER
PCB and AUTOMATION
Test and Automation
PCB and Test
Test and Assembly
SMT and Assembly
Assembly and Production
PCB and Production
Assembly and Production
PCB and Assembly
Assembly and Packaging
PCB and Manufacturing
SMT and Production
Test and Measurement
Components and Distribution
Production and Packaging
Test and Assembly
EMI Shielding Caulk Cures Quickly and Is Paintable
EMI shielding caulk provides EMI protection for military vehicle-mounted radar systems.
By Nick Pascucci, Parker Hannifin, Chomerics
Shielding of electromagnetic interference (EMI) is critical to many electronic systems, especially for military radar shelters. Contributing to this overall shielding is an EMI shielding caulk developed by Parker Hannifin's Chomerics Div. — a caulk that provides numerous mechanical benefits in addition to improved EMI ...
Ensuring Success in PCB Manufacturing and Assembly, Part 1
By Michael Ford, Senior Marketing Development Manager, Mentor Graphics Corp. (www.mentor.com)
Printed-circuit-board (PCB) manufacturing and assembly represents a crucial stage between the design of the next great technological device and the finished product. All critical business metrics, including cost, quality, and delivery, are directly affected by performance during production ...
Flexible System Checks Cables and Harnesses
By Margaret Bishop, CAMI
Wire cables and harnesses come in many shapes and sizes and testing such assemblies requires a flexible test system. The CableEye
test system from CAMI Research is a personal-computer-based diagnostic tool that can evaluate the basic electrical properties of cables and harnesses ...
Optical Encoders Help Measure Material Fatigue
By Jeff Drum (email@example.com)
Fatigue testing is one way to evaluate how different materials will behave under different environments and operating conditions. Test systems developed for such characterization, such as the equipment from Norwood, Massachusetts-based Instron can examine the behavior of different materials ...
The Fundamentals of Closed-Loop Solder Paste Inspection
By Ondrej Simecek, Marketing Dept., Test Research, Inc., Taipei City, Taiwan
Solder paste inspection (SPI) can provide invaluable information about electronic production quality. It is one of the first automated inspection systems employed in any automated printed-circuit-board (PCB) production line, and can offer details about the integrity of soldered connections ...
Avoid Performance Concerns Caused By Counterfeit Components
By Jeffrey Paulownia
Counterfeit electronic components have become more than a minor concern for users of electronic products. Counterfeit components and integrated circuits (ICs) have invaded the supply chains for a wide range of commercial, industrial, and military electronic design projects. And while ...
EPA Compliance: Understanding Management of Solder Waste
By Peter C. Ruth II, North American Business Manager, and Nelson Mossholder, Ph.D., VP, Conecsus LLC, Terrell, TX
Managing solder wastes and byproducts has grown in complexity over the years, due to the increasing complexity and scope of the Resource Conservation and Recovery Act (RCRA) enacted in 1976. Anyone generating hazardous wastes is responsible and liable for those wastes. so it is important ...
Manufacturer Innovates Test Probes And Fixtures
Konstanz, Germany — The phrase "Made in Germany" still has meaning for Ingun, a company known for its standard and custom test probes and fixtures. The family-run business, about to celebrate its 43rd year of operation this year, is represented in 46 different countries around the world and still manufactures ...
PXI Expansion Enhances Automotive Dashboard Testing
By Alan Albee, In-Circuit Test Product Manager, System Test Group, Teradyne
The flexibility and affordability of modifying test stations equipped with PXI expansion boards was experienced recently by a manufacturer of high-volume automotive dashboard electronic units when they replaced a functional test system with a standard in-circuit tester (ICT) with PXI ...
Recent Advances in Die Attach Film
Frederick Lo, Maurice Leblon, Richard Amigh, and Kevin Chung. AI Technology, Inc., Princeton Junction, NJ
Growing demand for hand-held electronic devices has led to greater use of two-and-one-half-dimensional (2.5D) and three-dimensional (3D) packaging and in the handling of extremely thin wafers and dies. The material-supply industry has responded in providing newer generations of die ...
Some Paths to Help Streamline Overseas Factories
By Yusaku Kono, Marketing Director, Japan UNIX Co. Ltd., Tokyo, Japan
China, often referred to as the "world's factory," may have reached a turning point. Maintaining effective and efficient production is critical for continued successful business, and many manufacturers may rely on overseas production for survival. China, with its half-billion-strong ...
XetaWave Achieves Advanced SMT Production With SIPLACE SX
By Mark Ogden, Marketing Manager, ASM Assembly Systems
XetaWave is a manufacturer of high performance, reliable industrial wireless data radios. Customers of XetaWave demand high reliability and robust data transmission in support of mission critical applications. With these stringent requirements in hand, the company went about selecting ...
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