Delaware, OH — Engineered Material Systems, Inc. (EMS), a global supplier of negative photoresist materials for MEMs and IC cooling applications, is introducing the DF-4017 Dry Film Negative Photoresist for use in micro-electromechanical systems (MEMS). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
|Cross-section showing how new photoresist works. |
DF-4017 film was developed to produce extremely hydrophobic (>90° contact angle) film surfaces. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-4017 film is tougher (less brittle) than most negative photoresists on the market, with a glass transition temperature of 145°C (by DMA Tan Delta) and a moderate modulus of 4.5 GPa at 25°C. The cured chemistry is hydrophobic in nature, providing excellent chemical and moisture resistance.
DF-4017 film is compatible with and can be used in contact with the EMS line of spin coating photoresist. DF-4017 dry-film photoresist is the latest addition to EMS' full line of film and liquid negative photo resists formulated for making microfluidic channels and permanent features on MEMS devices and integrated circuits.
Contact: Engineered Material Systems, Inc., 132 Johnson Dr., Delaware, OH 43015 740-362-4444 fax: 740-362-4433 Web: http://www.emsadhesives.com.