Carteret, NJ — SARCON® SPG-30A from Fujipoly is an excellent thermal interface option for circuit boards with a large surface area, many components and delicate solder points. The form-in-place silicone compound completely fills all spaces, gaps and protrusions when compressed by a heat sink or spreader. The material's high viscosity and ultra-low compression force are suitable for applications with gaps ranging from 0.30 to 1.0mm. Once applied, SARCON SPG-30A delivers a thermal conductivity of 3.2W/m°K with a thermal resistance of only 0.3°Cin2/W. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40 to +150°C). The material is available in 30ml tubes and 325ml cartridges.
|Highly thermally conductive compound. |
Contact: Fujipoly America Corp., PO Box 119, Carteret, NJ 07008-0119 732-969-0100 fax: 732-969-3311 E-mail: firstname.lastname@example.org Web: http://www.fujipoly.com