||Marlborough, MA — DownStream Technologies, LLC has released the latest version of its design for manufacturing solution, DFMStream®. The release includes many new features and performance improvements and greatly enhances the support provided to the new product introduction (NPI) process.
DFMStream 11.0 introduces over 70 additional DFM analysis checks to support both the PCB fabrication and assembly processes. The analysis expansion was designed to satisfy requirements for advanced vias, back drilling, fine pitch SMD components, tighter tolerances for solder and paste masks and other advanced technologies. Designs with advanced via types can be analyzed for minimum clearances to specific via types. For example, pads and traces can be analyzed for adjacency to laser vias independent of blind or buried vias and other such advanced design constructs. Paste mask can be assessed as a ratio of pad area coverage. Drill depth can be assessed as a ratio of board thickness.
DFMStream allows the user to add design intelligence to Gerber and NC files by assigning Gerber/drill elements unique properties such as laser via, blind and buried via, back drill and so on. Once identified, advanced DFM analysis can be performed specific to the type of construct.
Contact: DownStream Technologies, LLC, 225 Cedar Hill Street, Ste. 333, Marlborough, MA 01752 800-535-3226 or 508-970-0670 fax: 508-481-0362 E-mail: firstname.lastname@example.org Web: http://www.downstreamtech.com