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Tuesday, January 24, 2017
VOLUME - NUMBER
Front Page News
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Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Test and Assembly
Product Preview: SEMICON West
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July 2014 Issue
Electronic Mfg. Products
Asset and Synopsys Collaborate on JTAG Tools
Richardson, TX — Asset
InterTech, a supplier of tools for embedded instrumentation, has collaborated with Synopsys, Inc., a global provider of software, IP and services used to accelerate innovation in chips and electronic systems, on a proof-of-concept case study demonstrating the viability of an IJTAG ...
Corelis JTAG Test System Assists in Air Force Readiness
Cerritos, CA — Corelis, Inc.'s ScanExpress family of products has been selected by the U.S. Air Force as an attachable component in the Versatile Depot Automatic Test Station (VDATS) program to meet current JTAG requirements. VDATS is an enterprise test solution employed by the Air Force and Department of Defense ...
DDM Novastar: New Low Cost Placer
Philadelphia, PA — DDM Novastar has launched a brand new entry-level pick-and-place machine. The L-SF40 is a complete, affordable turnkey automatic pick-and-place system that can be put in production right out of the box. The system is managed by a full desktop Windows
computer with flat screen ...
DEK: Intelligent Print Techniques
Oirschot, the Netherlands — DEK is fielding a comprehensive range of printing technologies including understencil cleaning chemistries, high performance fabrics and award-winning VectorGuard High Tension stencils to a brand-new print platform innovation. The company's Gemini platform, a printing ...
Ersa Offers Flexible Soldering System
Plymouth, WI — Kurtz Ersa North America has recently developed and released the new Mini VARIO Wave, a game-changing option for its selective solder systems. The Mini Wave feature offers users the ability to combine a selective solder machine with a wave soldering process in one soldering system ...
Goepel: Shadow-Free 3D Measurement
Jena, Germany — The AOI systems of the OptiCon family made by Goepel electronic extend their dimension with a new measurement technology that has evolved to become the "3D Series".
Hitachi Intros Stack Stick Feeder
Dallas, TX — Hitachi High-Tech Instruments has introduced its new Stack Stick Feeder for the Sigma Series modular mounters. The Stack Stick Feeder is especially well-suited for feeding odd-form components to the mounter. The feeder can accommodate up to 6 sticks at a time, with maximum length of ...
Improved Dip Soldering Systems from Manncorp
Willow Grove, PA — New models of Manncorp's popular Auto-Dip series include features that take dip soldering technology to new levels of performance and reliability. While dip soldering of through-hole components has long been an easy and affordable way to automate manual soldering processes when ...
Juki Intros Six Zone Reflow Oven
Morrisville, NC — Juki Automation Systems (JAS), Inc. has released its new RS-600 Six Zone Air and Nitrogen Reflow Ovens. The new model will greatly assist the company in promoting its "Total Line Solutions" sales strategy into LED and OEM accounts. The RS-600 reflow ovens offer the same feature ...
Macro Sensors: Where Made in USA Makes the Difference
Pennsauken, NJ — Reshoring never posed much of a problem at Macro Sensors, since the company already maintains much of its manufacturing at its Pennsauken, New Jersey headquarters, producing linear and rotary position sensors that are all "Made in the USA". "As customers often demand some specialization ...
PDR SMT/BGA Rework System Uses Focused IR
Shingle Springs, CA — PDR's Focused IR technology used in the IR-E3Vi Gold, makes the system an extremely powerful and cost effective SMT/BGA rework tool that has been designed to meet all the needs of its users. It is a professional high end system aimed at reworking small-to-medium size PCBs with ...
Photo Stencil Offers NiCut Step Stencils
Colorado Springs, CO — Photo Stencil, LLC is now making its step stencils using the company's the company's special new NiCut
high-performance stencil technology that delivers the quality advantages of an electroform stencil, but with faster turn-around time.
Rehm: New Vapor Phase Soldering System
Roswell, GA — Rehm's new CondensoXS vapor phase soldering system which has a significantly smaller footprint without giving up any process features, permits vapor phase soldering in the smallest possible space. Void-free soldering is no problem for any of the systems included in the Condenso range ...
RPS Adds High Volume Lead Tinning
Spokane Valley, WA — RPS Automation LLC., a manufacturer of automated precision soldering equipment for electronics assembly and manufacturing, has introduced the Dynamic Rotary Head for Odyssey Lead Tinning Systems. This feature enables high volume lead tinning of QFPs and other multi-sided SMT ...
Seika Now Offers UNITECH PCB Board Cleaner
Torrance, CA — Seika Machinery, Inc. now distributes the UNITECH UC-250M-CV PCB Board Cleaner. The new UC-250M-CV has all the features of the UC-250M and adds a dual cleaning feature using a combination of a brush roller with the silicone/adhesive cleaning rollers.
Speedline Launches Space-Saving MPM BTB Printers
Franklin, MA — SMT electronics assemblers can nearly double their stencil printing throughput without doubling their machine footprint with the new MPM Momentum BTB (Back to Back) printer. The space-saving printer is 200mm shorter than the standard Momentum with an overall length of 2.8m for the ...
Techspray Expands Inline and Batch Cleaner Lines
Amarillo, TX — Techspray introduced two new defluxers into the Techspray Renew Eco-dFluxer inline and batch cleaner product line: Eco-dFluxer SMT200 and Eco-dFluxer SMT300. These new products offer increased cleaning performance, better metals compatibility, and reduced environmental impact. ...
Ziptronix Technology Licensed to IO Semiconductor
Research Triangle Park, NC — Ziptronix Inc., a provider of patented, low-temperature direct bonding technology for 3D integration, has provided a limited exclusive patent licensing agreement with IO Semiconductor (IOsemi) for application of its ZiBond technology for use in RF front-end devices for consumer ...
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