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Machine Vision Products Demos Diverse Inspection Toolbox for Microelectronics and Packaging at Semicon West 2014
CARLSBAD, CAMachine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the MVP 850G Microelectronics and Packaging AOI platform at the Semicon West 2014 exhibition. The exhibition is at the Moscone Center in San Francisco from July 8-10 2014. Machine Vision Products are exhibiting at booth #6367 in the North Hall.

MVP demonstrations will include leadframe inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities.

In 2014 MVP has continued to push the boundaries of performance, speed and ease of use to a new level on the 850G platform by introducing new hardware such as faster multiprocessor technology and new higher resolution cameras.

MVP has also introduced the 850 DWMS (Die Wire Metrology System) including MVP’s own integrated Magazine handlers for leadframe inspection allowing users to attain a UPH throughput of 25000 and above.

The MVP 850G is flexible within multiple locations of microelectronics and packaging lines. For Lead Frame processes the 850G can be placed Post Die Bonder, Post Wire Bonder or Post Solder Ball Attach. Within Flip Chip processes the 850G can be positioned Post Wafer Bumping, Post Die Placement, Post Underfill and Post Final Packaging. With resolution and repeatability a critical factor, the 850G can be configured to provide a 1um pixel size.

The unit can be configured for Lot Solutions including Magazine Lifters/Indexers, Jedec Trays, Waffle Packs, and Auer Boats. MVP’s inline solutions allow for both single and dual lane processing, strip handling and in-line wafer handing. MVP also provide custom handling solutions.  In addition, it can be configured with post processing tools, including physical defect identification/sorting modules, customizable to customer requirements.

The MVP 850G integrates MVP’s easy-to-use programming tools and analytical process control tools in this platform. This convergence of technology from Machine Vision Products, Inc. delivers the best available combination of defect detection capabilities, metrology for process control and inspection throughput at a low cost of ownership

For additional information on this unique solution, please visit us at  or visit booth #6367 at Semicon West 2014 to discuss your application requirements.

CONTACT:  Email:   PH: +1-760-438-1138

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