||ALBANY, NY - YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.
SMT 88 is an adhesive, which combines the advantages of fast cure in UV adhesives, and the better reliability of capillary underfill. It can be underfilled at room temperature without preheating a substrate. Advantages include void-free underfill, easy rework, easy dispensing, outstanding reliability, and excellent mechanical resistance.
SMT 88 can be used not only as an underfill for chip scale packaging, but also on ball grid array devices, package on package, land grid array, and certain flip chip applications. It is also suitable for bare chip protection in a variety of advanced packages such as memory cards, chip carriers, hybrid circuits and multi-chip modules. SMT 88 is also available at a higher viscosity if it is needed.
Additional information on the product is available at http://yincae.com/board-level-assembly.html or by contacting YINCAE at firstname.lastname@example.org.