Thursday, April 26, 2018
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Assembléon’s new 7 micron Hybrid solution @ Semicon West USA
VELDHOVEN, THE NETHERLANDS - Assembléon will show its presence at the Semicon West 2014 to present its 7 micron Hybrid solution (July 8 – 10 at the Moscone Center, San Francisco, North Hall , booth #6267).

The rapid technology changes and miniaturization have caused a just as rapid shift of specialized equipment, normally present in traditional PCB assembly, to move into Advanced Packaging industry.

For many, the existence of PCB assembly machines in the Semiconductor Backend market is still an unknown or considered strange as it is considered a different league. Assembléon’s presence at the Semicon West exhibition shows that it can be different and will discuss the concept, the advantages, its current references and technology roadmap of its Hybrid equipment.

The Hybrid systems have a unique proposition in the Packaging and Assembly market as it is the only system incorporating a single/pick single/place concept, now capable of 7 micron placement accuracy! The advantage of a Placement Head that carries only one component at a time is that, at full speed, it’s process can be fully optimized, monitored and controlled during the complete pick, dip and place cycle. The unique incorporated low-force closed-loop placement process takes care that even the thinnest devices can be placed accurate and its incorporated impact control takes care that no impact forces are applied during placement to guarantee the highest quality. It is therefore the only system that has very high production yields with an established placement defect rate lower than 1 defect per million placements (< 1 dpm). Besides the placement quality, it brings the traditional ingredients of the PCB assembly market, such as application flexibility, very high speed, accuracy, efficiency and cost control, along into the Advanced Packaging and Embedded Component Packaging markets.

The unique Hybrid, a cross-over platform between the PCBA market, WLP, SIP and ECP markets, combine high speed passive placements (up to 121,000 passives per hour) with high speed flip chip placement (up to 27,000 flip chips per hour) with flip chip accuracies at 7 microns at any placement location and angle on a substrate. The controllable placement Z-axis can adapt its placement height search algorithms for different heights, optimizing its placement force and process for 2.5D mounting, Package on Package or Embedded Passive and Active Devices applications.


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