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Get True Solder Paste Measurement and Accurate Pre-reflow Inspection from CyberOptics at NEPCON Thailand
MINNEAPOLIS, MN - CyberOptics Corporation (Nasdaq: CYBE) announces that it will showcase the new QX150i™ AOI system in Booth D525 at NEPCON Thailand, scheduled to take place June 19-22, 2014 in the Singapore Pavilion. The multi-award winning SE600 3D SPI system and QX100 tabletop AOI system also will be displayed at the show. All CyberOptics’ inspection solutions come with the assurance of quality, accuracy and speed.

The new QX150i™ AOI system offers high value and flexibility and is ideally suited for pre-reflow and selective solder inspection. Powered by an 80 megapixel sensor, QX150i™ significantly improves solder joint and 01005 inspection performance and provides crisp images for accurate defect review. The system is also designed to provide easy wedge-in replacement of existing conveyor.

The SE600™ 3D SPI system delivers ‘true’ volume measurement and world-class usability. Designed with a state-of-the-art dual illumination sensor, it offers the best repeatability and reproducibility – even on the smallest paste deposits. The award-winning SPIv5 series software offers full touch screen capability and world-class user experience for easy, flawless inspection. CyberPrint OPTIMIZER, a unique value-add program, that automatically optimizes the printing process is part of the SE600 software portfolio.

The QX100 tabletop AOI system offers true, inline performance. All CyberOptics’ AOI systems are powered by AI2, giving you the power to inspect ‘ANYTHING’ without having to anticipate defects or predefine variance. AI2 offers precise discrimination even with excessive variance and delivers accurate results with just one example. All this means lowest false calls, zero escapes and minimal tuning. 


 For more information, visit the Company’s website at

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