Delaware, OH — New from the adhesives division of Engineered Material Systems is its 535-10M-49 UV cured epoxy adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications. The material contains a secondary thermal cure initiator that cures as low as 110°C for shadowed areas. The new material is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. The material is designed to eliminate any warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.
|UV cure adhesive. |
This new non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. It is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony.
The compound was developed to pass the rigorous reliability requirements in microelectronic assembly applications. It is the latest addition to the company's extensive line of materials designed for semiconductor, photovoltaic, circuit assembly, printer head, camera module, disk drive and photonic applications.
Contact: Engineered Material Systems, Inc., 132 Johnson Dr., Delaware, OH 43015 740-362-4444 fax: 740-362-4433 Web: http://www.emadhesives.com.