Friday, October 28, 2016
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Deca Ships 100 Millionth Chip Scale Pkg.
Tempe, AZ — Deca Technologies, an electronic interconnect solutions provider to the semiconductor industry, has shipped its 100-millionth component. The company attributes this milestone to strong demand from portable electronics manufacturers for wafer-level chip scale packages (WLCSP) manufactured using Deca's special, integrated Autoline production platform, which is designed to achieve faster time-to-market at lower cost.

Leveraging advanced Autoline volume production technologies from SunPower Corp., a solar technology and energy services provider, Deca quickly achieved this milestone by addressing cycle time and capital cost challenges that semiconductor device manufacturers have struggled with using the conventional approach to WLCSP manufacturing.

Demand for WLCSP is being driven by manufacturers of wireless connectivity, audio and power management components for the handset and wearable electronics markets. Demand fluctuations in these markets can lead to challenges in managing inventories.

Contact: Deca Technologies, 7855 S. River Parkway, Ste. 111, Tempe, AZ 85284 480-345-9895 E-mail: Web:

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