Monday, May 30, 2016
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Quik-Pak Expands Enhanced Molding and Assembly Services
San Diego, CA — Quik-Pak, a provider of IC packaging, wafer processing, and advanced assembly services, has expanded its transfer molding and assembly capabilities to accommodate the increased demands of innovative companies in the wireless electronics and solar industries. Quik-Pak's newly expanded manufacturing space, which is dedicated to its transfer molding operation, will be utilized to meet the volume demands of its customers. The company has also expanded its wafer preparation facility to accommodate new equipment capable of supporting high-volume wafer backgrinding and dicing operations.


Contact: Quik-Pak, 10987 Via Frontera, San Diego, CA 92127 858-674-4676 fax: 858-674-4681 E-mail: moreinfo@icproto.com Web:
http://www.icproto.com or http://www.delphon.com

 
 
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