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Archive >  June 2014 Issue >  Front Page News > 

Linking Atomic Structure to Parts Performance

Albuquerque, NM — Humans have used metals for thousands of years, but there's still a lot about them that isn't fully understood. Just how much stretching, bending or compression a particular metal will take is determined by mechanical properties that can vary widely, even within parts made of the ...

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Wearable Electronics: Here Come the Novelty Peaks


Last Christmas and New Year the ideal present for a girl of a certain age, from Japan to the UK was the neurowear clip-on of floppy ears driven by brain waves to reflect your mood. They would have been played with for one day and then put away forever. Such novelty peaks can be expected with many ...
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Attracting Larger U.S. Workforce to Growing Manufacturing Industries

Rolling Meadows, IL — With the market continuing to drive up demand for more workers in numerous manufacturing industries, the Association for Manufacturing Excellence (AME) is leading the charge to reinvigorate the national workforce and attract new personnel. AME continues to connect experienced workers with ...
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SEMI: North American Semiconductor Equipment Industry Posts November 2017 Billings
MILPITAS, CA - North America-based manufacturers of semiconductor equipment posted $2.05 billion in billings worldwide in November 2017 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. 
Avnet Sponsors The Not Impossible Awards Recognizing Emerging Technologies that Improve Lives
Avnet, a leading global technology distributor, today announced its title sponsorship of The Not Impossible Awards, which recognizes the breakthrough achievements of innovators who share the Not Impossible Labs mission to create inventive technology that improves the well-being of others. 
aveniĀ® S.A. Extends Copper Interconnects to 5nm and Below for BEOL Integration Using Innovative Electroplating Chemistry
MASSY, France - aveni S.A., developer and manufacturer of market-disrupting wet deposition technologies and chemistries for 2D interconnects and 3D through silicon via packaging, today announced it has obtained results that strongly support the continued use of copper in the back end of line (BEOL) for advanced interconnects, at and beyond the 5nm technology node. 
Kilopass NVM OTP IP Achieves 3-Lot Qualification on GLOBALFOUNDRIES 14nm LPP (Low Power Process) Process Technology
SAN JOSE, CA - Kilopass Technology Inc., a leading provider of semiconductor logic embedded non-volatile memory (eNVM) intellectual property (IP), today announced that it successfully achieved a three-lot qualification on GLOBALFOUNDRIES (GF) 14nm LPP (Low Power Process) technology platform for its one-time programmable (OTP) NVM technology. 
 
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