NORTH BILLERICA, MA — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing and alternative energy markets, will participate in ACI Technologies' Technical Exposition, scheduled to take place May 14-15, 2014, at the ACI facility in Philadelphia, PA. The free two-day event will feature equipment demonstrations and technical presentations.
Mastering the solder paste reflow profile is usually the last step to locking down the SMT assembly. An industry expert from BTU will discuss the development of reflow profiles for printed circuit board solder reflow, semiconductor packaging and lead-free processes.
To register for the event, contact Katie Riggan by phone at 610-362-1200, extension 250 or via email at email@example.com. Please note that capacity is limited, so reserve your place today. For more information on the ACI Technologies' Technical Exposition, the complete agenda can be seen here.
For more information about BTU International, visit