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Visit Kyzen at NEPCON Malaysia 2014 to Learn about Two of Its Award-Winning Cleaning Agents
NASHVILLE, TN — Kyzen announces that it will take Malaysia by storm during NEPCON Malaysia 2014. From June 10-12, 2014 visit the company in Booth #G20 at the Penang International Sports Arena (PISA) to see firsthand the AQUANOX® A8820 Advanced Aqueous Stencil Cleaner and the AQUANOX® A8830 Low VOC Aqueous Stencil Cleaning Agent.

Designed for the tough challenges of cleaning no-clean and lead-free residue while being compatible with modern nano-coatings and all offline cleaning equipment, AQUANOX® A8820 is an engineered Micro Cell Technology (MCT™) cleaning fluid designed to remove wet solder paste and uncured chip bonder adhesive from stencils used in surface mount printing processes. A8820 removes common solder pastes and fluxes, and demonstrates a favorable compatibility profile with stencil cleaning systems. It works well with spray-in-air and select ultrasonic cleaning machines, and is effective on uncured adhesives.

AQUANOX® A8830 is Kyzen’s newest low-VOC aqueous stencil cleaning agent. Environmentally progressive, this formulation is highly effective at removing all types of solder pastes (water soluble, rosin, and no-clean) from fine-pitch apertures. A8830 is a low-odor cleaner than can be used in open systems. The state-of-the-art environmental properties of A8830 make it an ideal option for areas where air emissions are highly regulated.

These award-winning cleaning chemistries are available in 25 and 200 liter (five, and 55 gallon) containers.

Kyzen® and AQUANOX® are registered trademarks in the United States and other countries.

For more information, please visit www.kyzen.com.

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