NASHVILLE, TN — Kyzen announces plans to exhibit CYBERSOLV® C8882 at the SMTA Atlanta 18th Annual Expo & Tech Forum, scheduled to take place Wednesday, May 7, 2014 at the Gwinnett Civic Center in Duluth, GA. C8882 is a fast-acting stencil cleaning solvent designed for the under-stencil on printer wipe cleaning process.
C8882 instantly dissolves all flux types within the solder paste, including water soluble, rosin and low residue no-clean fluxes. C8882 dries quickly, eliminating the streaking and smearing experienced with traditional cleaning solvents. The solvent is non-flammable, removes all flux types, and does not interact or remove nano-coatings.
CYBERSOLV® C8882 is available in one, five and 55 gallon containers as well as 16 ounce spray bottle containers and pre-saturated wipes.
Kyzen® and CYBERSOLV® are registered trademarks in the United States and other countries.
For more information, please visit www.kyzen.com.