HANAU, GERMANY - At the SMT Hybrid Packaging 2014, Heraeus presents products from the range Bonding Wires and Circuits & Components. The International Trade Fair for System Integration in Micro Electronics will take place from 06th to 08th May in Nuremberg, Germany.
Tutorial and Presentation
Heraeus experts will be talking about industry-relevant technical topics at the SMT. Jörg Trodler, Development Engineer Assembly Materials, will be conducting a tutorial on the subject “Solder Joint Quality in the Lead-free Assembly and Interconnection Technology” (06th May 2014 from 2 to 5 p.m). Jürgen Dick, Product Management Wedge Bonding Wires, will be giving the lecture “Aluminum, Copper, Hybrid – Advanced Bonding Wires for Power Electronics" (07.05.2014 at 11:00 a.m., Exhibition Forum, hall 9).
Products from the Bonding Wire range
At SMT Hybrid, Heraeus will be presenting bonding wires and ribbons based on precious metals as well as more cost-effective materials. The company will be focusing on products made of aluminum, copper and bondable aluminum-copper hybrid materials. These bonding wires increase the durability and reliability in robust electronic power modules. In addition, the manufacturer shows its new range of alloyed silver wires and coated bonding wires.
Enlarged product portfolio – from Thick Film to Circuits & Components
At the beginning of the year, the former Thick Film Business Unit merged with part of the Conductive Polymers Division to form a new Business Unit: Circuits & Components. In the course of the restructuring process, the Business Unit now offers a comprehensive product portfolio of silver pastes and high-end conductive polymers, mainly employed in the manufacture of capacitors. This consolidated portfolio will be presented at the SMT show for the first time. The reorganization bundles products and competencies enabling Heraeus to enlarge its range and provide customized solutions from one source.
Within the new BU, Heraeus offers conductive polymers (brand CleviosTM) for solid electrolyte capacitors (tantalum and aluminum). Newly developed thick copper system, the material system Celcion™ for LED applications, low temperature pastes for OLED applications and Pb-free resistor pastes are further highlights at the Heraeus booth.
Visit Heraeus at:
– SMT Hybrid Packaging from 06th to 08th May 2014 in Nuremberg, Germany, exhibition hall 9, booth 340!
– PCIM 2014 (Power Conversion Intelligent Motion) from 20th to 22nd May 2014 in Nuremberg, Germany, exhibition hall 7, booth 246!
Web: http://heraeus-materials-technology.de and http://heraeus-precious-metals.de