SHANGHAI, CHINA -Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that it has been awarded a 2014 EM Asia Innovation Award in the category of Pick-and-Place Systems (Multi-function) for its multi-functional SMT Center. The award was presented to the company during an April 24, 2014 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and mount components in one machine.
The multi-functional SMT center Paraquda meets all the requirements of a modern, highly flexible production system - changeover without downtime, component management, and the integration of jet printing of solder paste or glue. Paraquda combines two different production steps within one machine platform (solder paste jetting and SMD assembly). With this unique combination, the multifunctional center allows an unprecedented flexibility in the market.
Essemtec’s solder jet printer is fast (up to 80,000 dots/hr), very precise (51µm @3σ) and suitable for 0201 components. So far, jetting of solder pastes was possible only with limitations – electronics manufacturers needed to buy specially designed, costly solder pastes. The new system from Essemtec opens the range of pastes to most type 4, 5, 6 or 7 pastes. Essemtec’s solder paste jet valve can be installed on existing machines platforms, such as the Scorpion high-speed jet dispenser or the Paraquda component placer. Production is fully automated, and solder paste application and component placement are seamlessly integrated while process monitoring ensures high-quality results.
For more information about Essemtec's SMT production center, visit www.essemtec.com.