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Rogers Corporation to Exhibit High Performance Circuit Materials at Del Mar Electronics Show
CHANDLER, AZ - Rogers Corporation (NYSE:ROG) will be showing samples of the company’s wide range of industry-leading printed-circuit-board (PCB) materials at the Del Mar Electronics & Design Show (DMEDS, www.electroshows.com/delmar) April 30-May 1, 2014 at the Del Mar Fairgrounds in San Diego, CA.

Representatives from Rogers Corp. (www.rogerscorp.com) will be at Booth 622 with information and insight on the use of their circuit materials, including COOLSPAN® TECA film, RO4835™ high-frequency laminates, and RO4360G2™ high-frequency laminates.

Rogers COOLSPAN TECA film is a thermally and electrically conductive adhesive that is ideal for bonding circuit boards to heavy metal backplanes, heat sinks, and housings. The thermosetting, epoxy-based, silver-filled adhesive is a practical alternative to fusion bonding, sweat soldering, press-fit, and other mechanical approaches for attaching circuits to associated structures. COOLSPAN TECA film, which is supplied in sheet form on a PET carrier, is able to survive lead-free solder processing and offers outstanding chemical resistance and high temperature performance, helping you to keep things cool.

Rogers RO4835 high frequency laminates, specially formulated with improved oxidation resistance, were developed for applications needing improved stability over time and temperature, while maintaining the cost advantages of a thermoset, FR-4 processable material. Just as with RO4350B™ material, RO4835 laminates offer a dielectric constant of 3.48 at 10 GHz, a low loss tangent of 0.0037 at 10 GHz, and a low z-axis coefficient of thermal expansion (CTE) for excellent plated-through-hole (PTH) reliability under a variety of processing and operating conditions. These improved oxidation resistance circuit materials exhibit x- and y-axis expansion coefficients similar to that of copper. RO4835 laminates are RoHS-compliant, do not require special preparation, and can be processed using standard fabrication methods.

RO4360G2 laminates have a tailored high Dk of 6.15 @ 10 GHz, which allows next generation power amplifier designers to meet size and cost reduction targets. Specifically, the laminate’s higher Dk allows for a significant reduction in finished circuit board size (20-30%). RO4360G2 laminates process similar to FR-4, are automated assembly compatible, and offer the same reliability and repeatability that customers have come to expect from Rogers RO4350B material.

With a UL 94V-0 flame rating and fully lead-free process capable, these laminates possess excellent thermal conductivity of .81 W/m/K for improved reliability, a low Z-axis CTE for reliable plated through holes, and drill performance as good as or better than RO4350B laminates.

For more information, visit www.rogerscorp.com

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