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Nordson MARCH Introduces New MaxVIA-Plus? Plasma Treatment System for electronic circuit board fabrication
CONCORD, CA - Nordson MARCH, a Nordson Company (NASDAQ: NDSN), and global leader in plasma processing technology, introduces its new MaxVIA-Plus™ plasma treatment system at the Korea Printed Circuit Association (KPCA) exhibition, Gyeonggi-do, Korea, 22-24 April 2014, in their distributor Worldtechnology's booth #E301. The new MaxVIA-Plus™ plasma treatment system accommodates larger panel sizes within a small footprint during electronic circuit board fabrication for desmear, etchback, and landing pad cleaning operations.

Nordson MARCH's partner in Korea, Worldtechnology (www.worldtechnology.co.kr) has already received multiple orders from a major flexible PCB manufacturer for the MaxVIA-Plus and other plasma treatment systems.

The MaxVIA-Plus system treats HDI, flexible, and rigid panels, accommodating larger panel sizes within a small footprint (1.7 x 1.7 meters) for desmear, etchback, and landing pad cleaning operations. The new, larger, 15-cell chamber in the MaxVIA-Plus system processes more units per hour (UPH), resulting in high throughput and maximum production flexibility. Its unique vacuum and gas flow technology, new electrode designs, and superior temperature management creates a plasma system that delivers highly uniform PCB treatment.

"The advanced technology production processes in Korean PCB manufacturing demands high-performance plasma treatment equipment," explained Jonathan Doan, director of marketing, Nordson MARCH. "Our new MaxVIA-Plus™ plasma system delivers a superior level of plasma treatment uniformity at high throughput while also delivering reduced cost-of-ownership. We are pleased to introduce this new system with our Korean partner Worldtechnology."

Several factors make the cost of ownership for the MaxVIA-Plus™ one of the lowest in its class. The system features a compact and service-friendly design. The PCBs are vertically loaded using easy-loading carts, which minimizes idle time and improves productivity. The fast vacuum pump down, low gas consumption, and enhanced process cycle times further add to the throughput and productivity of the system.

Plasma treatment uniformity is a key operational feature in desmear and etchback applications for HDI, flexible and rigid circuit board fabrication. The MaxVIA-Plus utilizes a unique and patented plasma technology to produce superior uniformity at high throughputs. Plasma can deliver higher uniformity and reproducibility than chemical or mechanical processes.

The KPCA 2014 show is organized by the Korea Printed Circuit Association and sponsored by WECC (World Electronic Circuits Council) and AFEC (Asian Federation of Electronic Circuits). It will be held from April 22- 24, 2014 in KINTEX, Goyang, Gyeonggi-do, Korea.

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