|  CONCORD, CA - Nordson MARCH,
a Nordson Company (NASDAQ: NDSN), and global leader in plasma
processing technology, introduces its new MaxVIA-Plus™ plasma treatment
system at the Korea Printed Circuit Association (KPCA) exhibition, Gyeonggi-do, Korea, 22-24 April 2014, in their distributor Worldtechnology's booth #E301.
The new MaxVIA-Plus™ plasma treatment system accommodates larger panel
sizes within a small footprint during electronic circuit board
fabrication for desmear, etchback, and landing pad cleaning operations.
Nordson MARCH's partner in Korea, Worldtechnology (www.worldtechnology.co.kr)
has already received multiple orders from a major flexible PCB
manufacturer for the MaxVIA-Plus and other plasma treatment systems.
The MaxVIA-Plus system treats HDI, flexible, and rigid panels,
accommodating larger panel sizes within a small footprint (1.7 x 1.7
meters) for desmear, etchback, and landing pad cleaning operations. The
new, larger, 15-cell chamber in the MaxVIA-Plus system processes more
units per hour (UPH), resulting in high throughput and maximum
production flexibility. Its unique vacuum and gas flow technology, new
electrode designs, and superior temperature management creates a plasma
system that delivers highly uniform PCB treatment.
"The advanced technology production processes in Korean PCB
manufacturing demands high-performance plasma treatment equipment,"
explained Jonathan Doan, director of marketing, Nordson MARCH. "Our new
MaxVIA-Plus™ plasma system delivers a superior level of plasma treatment
uniformity at high throughput while also delivering reduced
cost-of-ownership. We are pleased to introduce this new system with our
Korean partner Worldtechnology."
Several factors make the cost of ownership for the MaxVIA-Plus™ one of
the lowest in its class. The system features a compact and
service-friendly design. The PCBs are vertically loaded using
easy-loading carts, which minimizes idle time and improves productivity.
The fast vacuum pump down, low gas consumption, and enhanced process
cycle times further add to the throughput and productivity of the
system.
Plasma treatment uniformity is a key operational feature in desmear and
etchback applications for HDI, flexible and rigid circuit board
fabrication. The MaxVIA-Plus utilizes a unique and patented plasma
technology to produce superior uniformity at high throughputs. Plasma
can deliver higher uniformity and reproducibility than chemical or
mechanical processes.
The KPCA 2014 show is organized by the Korea Printed Circuit
Association and sponsored by WECC (World Electronic Circuits Council)
and AFEC (Asian Federation of Electronic Circuits). It will be held from
April 22- 24, 2014 in KINTEX, Goyang, Gyeonggi-do, Korea. |