Tuesday, December 6, 2016
VOLUME - NUMBER
Advertisements
Home/Current Issue >  Daily News Archive > 

Share

GOEPEL electronic presents innovation fireworks at SMT/Hybrid/Packaging Show in Nuremberg/Germany
JENA, GERMANY - GOEPEL electronic will be at this year’s SMT/Hybrid/Packaging from May 6 to May 8, 2014 in Nuremberg, Germany not only to present numerous innovations, but also to present the new company slogan “Enjoy Testing” for the first time. As the world’s only company providing electronic and optical test and inspection equipment as a one-stop-shop, GOEPEL electronic convinces by its integrated support for quality assurance and promises its customers effective solutions that are simply enjoyable. And all this “Made in Germany”. The 3D-AOI, 3D-AXI and 3D-SPI systems, developed and manufactured in Jena, Thuringia, as well as the extensive portfolio of test programming tools by JTAG/Boundary Scan and Embedded System Access (ESA) are among the leading international solutions in their respective market segments. 

In hall 6 at stand 410, several innovations and news from GOEPEL electronic’s product divisions will be found:

In the field of automatic optical inspection GOEPEL electronic presents at this year’s SMT/Hybrid/Packaging a revolutionary innovation:

The 3D-AOI system – presented for the first time – is based on a telecentric measuring technology for the three-dimensional detection of assemblies and solder joints. The true 3D technology overcomes the board coverage disadvantages of traditional approaches such as shadowing caused by high components.

Furthermore, a preliminary version of the AOI system software PILOT 6.0 will be presented at the SMT/Hybrid/Packaging, which shows a significant step of development as well. Thus, in design of this software, emphasizes fast and easy test program generation, especially addressing inexperienced users. Guided operation via touch screen and 3D visualization of assemblies and entire PCBs are further components.  

The OptiCon TurboLine has been upgraded for double-sided inspection of SMD assemblies – alleviating the need for two separate AOI systems and a turning station. The high end In-Line-AOI system has made a further large step forward by increasing the test speed. Innovative solutions for optimizing image capturing technology and the test program execution enable an inspection time reduction of up to 50% for heavy utilization of angled-view inspection.

 In addition to the fully automatic 3D Inline-AXI system OptiCon X-Line 3D, the semi-automatic X-ray analysis system Scope-Line MX extends the portfolio of GOEPEL electronic. The manual X-ray system (MXI) offers a cost-efficient entry to the world of X-ray and is the result of a strategic cooperation with the well-established U.S. X-ray system manufacturer Scienscope. The new Scope-Line MX will be presented on the market for the first time at the SMT/Hybrid/Packaging. Furthermore, the 3D Inline-AXI system OptiCon X-Line 3D, which automatically combines optical and X-ray inspection (AXI + AOI = AXOI) in one single system, will be issued. Besides the presentation of increased inspection time, new features of the system software XI-Pilot 3.1 will be shown. Especially the interaction between CAD data, X-ray and AOI images in combination with the topoVIEW visualization provides the AXI programmer completely new possibilities for time-efficient test program generation.

Since its launch the 3D system OptiCon SPI-Line 3D represents technological excellence in the field of solder paste inspection and provides customer benefits, particularly in the areas of inspection security, speed and handling. Especially the latest version in the software section of the OptiCon SPI-Line 3D stands out due to several highlights: the new verify- and classification software enables the interaction e.g. with ASYS buffer band modules. Highlights of the new system software SPI-Pilot 1.4 with optimized 3D calculation are an advanced module for Statistical Process Control (SPC) and the ability of closed-loop to DEK printer systems.

The boundary-scan in-line programmer RAPIDO presents itself this year with two new features: The Fixture Identification and Data (FID) module enables an intelligent adapter based production control. It was specifically designed for the quick and safe arrangement of projects and helps to minimize user-related error sources. Furthermore, the in-line programmer has been equipped with a re-test function to test the failed devices again in order to exclude false calls. In addition, GOEPEL electronic will introduce a new SCANFLEX integration for Digitaltest’s ICT. The plug-in card especially developed for the MTS series forms the boundary scan transceiver for an optimal adaption to customer-specific assemblies. Another highlight will be the launch of the new SCANFLEX TAP transceiver SFX-TAP16/G-RM-FXT to 16 fold Gang Test, which was developed especially for critical signal environments.

CONTACT:GÖPEL electronic GmbH   Göschwitzer Str. 58/60  D-07745 Jena  PH: +49 - 3641 - 6896 – 0   Fax: +49 - 3614 - 6896 - 944     E-Mail: sales@goepel.com    www.goepel.com

                                          

Share

 
 
search login