Save. Share. Connect.
Saturday, October 22, 2016
VOLUME - NUMBER
Switches & Relays
Add Message Board
Dow Corning Intros Dispensable Thermal Pads
Dispensable thermal pads.
Midland, MI — Dow Corning has introduced Dow Corning
Dispensable Thermal Pads, an advanced new technology developed for more cost-effective thermal management of high-performance electronics targeting LED lamps and luminaires, data servers, telecommunications equipment and transportation applications. The new materials enable manufacturers to quickly and precisely print a layer of thermally conductive curable silicone compound in controllable thicknesses on complex-shaped substrates while ensuring excellent thermal management properties and reduced manufacturing cost.
The dispensable thermal pads offer the potential to reduce material costs by 30 to 60 percent by eliminating the waste more common to conventional fabricated thermal pads. They also enhance thermal performance and accelerate manufacturing cycles. The materials can be applied using standard screen or stencil print processes, or by using standard dispensing equipment. Either way, the material easily conforms to complex and unevenly shaped substrates and will cure in place to help increase throughput and provide greater flexibility over deposited layer thickness.
This new line encompasses four products, distinguished by varying levels of thermal conductivity with or without controlled bond line thicknesses.
Dow Corning TC-4015 and TC-4016 Dispensable Thermal Pads offer thermal conductivity of 1.5W/mK, and Dow Corning TC-4025 and TC-4026 Dispensable Thermal Pads offer higher 2.5W/mK thermal conductivity. Two grades, Dow Corning TC-4016 and TC-4026 Dispensable Thermal Pads, incorporate glass beads to offer improved control over bond line thickness.
All products in the company's new line bond well with common electronics substrates like aluminum and printed circuit boards. Plus, because they eliminate the fiberglass carrier used for conventional fabricated pads, Dow Corning's solution offers lower thermal resistance, excellent compression and consistently reliable, high-quality thermal management over the lifetime of a product.
Contact: Dow Corning Corporation, 2200 W. Salzburg Rd., Midland, MI 48686-0994
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | email@example.com
powered by GIM