Delaware, OH — Engineered Material Systems is introducing its CA-175 Low Cost, Snap Cure Conductive Adhesive designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics and camera modules.
|New adhesive for die attach. |
ECM CA-175 is approximately half the cost of a pure silver filled die attach adhesive, has a moderate glass transition temperature (Tg) and modulus. It has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, and is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces. CA-175 will fully cure in eight seconds at 200°C.
CA-175 is the latest addition to the company's extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
Contact: Engineered Materials Systems, Inc., 132 Johnson Dr., Delaware, OH 43015 740-362-4444 fax: 740-362-4433 Web: http://www.emsadhesives.com