Friday, June 22, 2018
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Engineered Material Systems Intros Snap Cure Conductive Adhesive
New adhesive for die attach.
Delaware, OH — Engineered Material Systems is introducing its CA-175 Low Cost, Snap Cure Conductive Adhesive designed for lead-frame die attach applications in semiconductors, circuit assembly, photonics and camera modules.

ECM CA-175 is approximately half the cost of a pure silver filled die attach adhesive, has a moderate glass transition temperature (Tg) and modulus. It has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, and is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces. CA-175 will fully cure in eight seconds at 200°C.

CA-175 is the latest addition to the company's extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

Contact: Engineered Materials Systems, Inc., 132 Johnson Dr., Delaware, OH 43015 740-362-4444 fax: 740-362-4433 Web:

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