Wednesday, October 26, 2016

Archive >  March 2014 Issue >  Front Page News > 

Semicon Growth Faces Serious Cost Challenges

New York, NY — Even though many analysts are projecting growth for the global semiconductor industry in 2014, structural challenges in the industry could threaten many companies, as more than half of 191 of the industry's publicly-listed companies face the risk of possible financial distress. As a result, the ...
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End-of-Life Doesn't Have to Kill Mother Earth

Denver, CO — End-of-life management of electronics, or lack thereof, has become a serious part of our overall ecological contamination. It's no longer enough to simply consign junked electronics to landfills — even after shredding. The landfills after all can accommodate only ...

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SEMICON Europa Opens Tomorrow in Grenoble, France
GRENOBLE, FRANCE - SEMICON Europa will open its doors tomorrow, showcasing the latest product, tools, and technologies for advanced microelectronics manufacturing. Co-located with the IoT Planet exhibition at the Alpexpo in Grenoble, France, SEMICON Europa features more than 400 international exhibitors representing all segments and sectors of the semiconductor supply chain. SEMICON Europa 2016 will run from 25-27 October.

World PCB Production in 2015 Estimated at $58.6 Billion
BANNOCKBURN, IL - The world market for printed circuit boards (PCBs) reached an estimated $58.6 billion in value in 2015 according to IPC’s  World PCB Production Report for the Year 2015. This represents a nominal decrease of 2.7 percent from 2014, but factoring out the effects of exchange rate fluctuations, the growth of PCB output was actually up 2.0 percent in real terms.

Session 4 of IPC & SMTA's Conference to Focus on Ultra-Thin or Nanocoatings
ROSEMONT, IL - Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

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