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Archive >  March 2014 Issue >  Front Page News > 

Semicon Growth Faces Serious Cost Challenges

New York, NY — Even though many analysts are projecting growth for the global semiconductor industry in 2014, structural challenges in the industry could threaten many companies, as more than half of 191 of the industry's publicly-listed companies face the risk of possible financial distress. As a result, the ...
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End-of-Life Doesn't Have to Kill Mother Earth


Denver, CO — End-of-life management of electronics, or lack thereof, has become a serious part of our overall ecological contamination. It's no longer enough to simply consign junked electronics to landfills — even after shredding. The landfills after all can accommodate only ...

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New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


Avnet Opens Registration for Global MiniZed SpeedWay Design Workshop Series: Training gives engineers head start in mastering design flows using Xilinx’s Vivado Design Suite
PHOENIX, AZ - Avnet, a leading global technology distributor, today announced that registration is now open for a series of interactive SpeedWay Design Workshops™ to help engineers jump start the development of single-core Xilinx® Zynq®-7000 All Programmable SoC devices using the Avnet MiniZed™ Zynq SoC development kit, a cost-optimized prototyping platform for embedded vision and Industrial IoT systems.
Coto Technology Awarded "Best of Show" (Silver) at Sensors Midwest 2017
ROSEMONT, IL - Coto Technology has been awarded Sensors Midwest's Best of Show "Silver" award for its newly-released RedRock TMR RR121 Magnetic Sensor. Seeking to replace aging magnetic sensor technology, the RR121 represents a huge breakthrough for design engineers seeking the lowest possible power consumption and highest sensitivity in an ultra-miniature package.
 
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