CLINTON, NY - Dr. Ning-Cheng Lee, vice president of technology, will give two presentations. His first presentation, Low Cost High Reliability Assembly of POP with a Novel Epoxy Flux on Solder Paste, discusses a newly-developed epoxy flux, compatible with solder paste, to address the failure of area array packages, such as BGAs, CSPs, and POP, when exposed to drop shock.
Dr. Lee’s second presentation, Voiding and Drop Test Performance of Lead-Free Low Melting and Medium Melting Mixed Alloys in BGA Assembly, reviews data collected while observing the voiding behavior of mixed solder alloy systems under a variety of conditions.
Tim Jensen, senior product manager for engineered solders, will teach a professional development course entitled Understanding and Solving Head-In-Pillow, Non-Wet Open, and QFN/CSP Voiding Challenges. This course will cover many of the factors that contribute to the three most challenging lead-free assembly defects and how to optimize processes and material to reduce the potential for these issues. It also includes a thorough discussion of the mechanisms leading to these defects and why they are more prevalent today than in the past.
Dr. Andy Mackie, senior product manager for semiconductor assembly materials, will present Current and Emerging Gaps in Standards for Semiconductor Assembly Materials in the Era of 2.5D and 3D Dimensional Devices. This presentation explores emerging materials, processes, and failure modes in evanescent materials relevant to waferlevel packaging, ball-grid array, flip-chip, as well as 2.5D and 3D. It will also discuss critical caps in criteria for quantifying materials performance that needs to be addressed as the industry expands into the era of dimensional 2.5D and 3D devices.
Eric Bastow, assistant technical manager, will present The Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues. In his presentation, Bastow will talk about the effect of reflow profiling on the electrical reliability of no-clean flux residues that can be measured using IPC J-STD-004 surface insulation resistance (SIR) testing using both halogen-free (ROL0) and halogen-containing (ROL1) Pb-free no-clean solder paste.
Additionally, several Indium Corporation technology experts have been selected to give poster presentations and serve as session chairs.
For more information about the presentations or to register for the conference, visit www.ipcapexexpo.org.
For more information about Indium Corporation, visit www.indium.com or email email@example.com.