Tuesday, June 28, 2016
VOLUME - NUMBER
Advertisements
HOME / CURRENT ISSUE >  Daily News Archive > 

Share

Speedline Debuts Breakthrough Production Solutions for Printing, Dispense, Soldering, and Cleaning at IPC/APEX 2014

FRANKLIN, MA Speedline Technologies, an Illinois Tool Works (ITW) company, will introduce exciting new systems and technology for PCB printing, dispensing, soldering, and cleaning to the U.S. electronics assembly market at IPC/APEX 2014. They will be exhibited March 25 – 27, 2014 in Booth #2215 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV, USA.

In making the announcement, Scott Koizumi, Vice president/General Manager, said, “Every year, Speedline, the technology leader in world-class legacy brand equipment, brings new and improved electronics manufacturing technology to APEX. At Speedline, we’re constantly investing in R&D and engineering, so that we can continuously provide our customers with cutting-edge productivity solutions.”

On exhibit will be the CAMALOT® Prodigy™ automated dispenser, fast, precise, compact, and configurable. Prodigy out-performs less capable dispensers from adhesives to solder paste. Prodigy is the next-generation dispenser that’s already here, featuring a small footprint, 2 zone configuration, and high accuracy of +/- 35 microns @ 3 sigma. Two Prodigy systems will be on display, one equipped with the new NanoShot pump.

CAMALOT’s new NanoShot™ pump is the next generation of ‘jetting’ technology. Offering high speed, up to 600 Hz, and ultra-fine resolution with dot sizes <300 microns, this patent-pending pump features state-of-the-art motion control technology, simple maintenance, quick changeover, and a low cost of ownership.

Also on exhibit will be the MPM® Momentum® Compact printer, offering high speed and unmatched accuracy in a 30% smaller footprint. Momentum Compact delivers a wet print accuracy of 18µ @ 6σ, Cpk>2 for superb fine feature printing performance, and can be configured for space-saving Back-to-Back processing. The MPM Momentum Compact can be equipped with the MPM EnclosedFlow™ enclosed media print head, which delivers superior volume/yield on fine pitch pads.

Offering the best of both worlds – printing and dispense – will be MPM’s high-efficiency Momentum HiE printer equipped with CAMALOT Inside. With CAMALOT Inside, it’s just that – fast, accurate CAMALOT dispensing capability within an MPM Printer. See printing and dispensing working together in harmony within the same platform, for ultimate flexibility and productivity.

Speedline’s software developers are continually advancing Speedline’s Windows 7 – based Benchmark® software and user interface. Now, Benchmark features OpenApps™ Open Software Architecture (Patent Pending). Customers get functionality without custom development, and can create their own apps! Speedline is the first SMT company to offer open software architecture.

Electrovert® will debut several new products, solutions, and proven performers. Electrovert will debut their ‘next generation’ Electra® wave soldering system, with 24” process width capability. Electrovert will also exhibit the new OmniES™ 5 five-zone reflow oven, with IsoThermal™ chamber technology. The OmniES 5 product offering will include the full list of high-end features and capabilities in a space saving package, low operating costs, and more importantly, an alternative to other low-cost ovens. Additionally, Electrovert’s Aquastorm™ series cleaners (batch and in-line) provide technology-based advantages that are focused on optimizing the cleaning and drying process.  With new features such as ‘misprint cleaning’ and ‘chemistry concentration monitoring’, Electrovert continues to demonstrate how process control and flexibility can be 100% integrated into the precision cleaner. All of these innovations will be on exhibit in Booth #2215.

Share

 
 
search login