Sunday, August 20, 2017
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Form-in-Place Thermal Compound from Fujipoly

Carteret, NJ — Fujipoly's new SARCON® SPG-50A form-in-place gap filler material delivers a thermal conductivity of 5.0W/m°K. In addition, the new silicone-based compound exhibits ultra-low compression force making it suitable for applications that have delicate components or low compression requirements ...
 
 
 
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