Friday, February 23, 2018
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Form-in-Place Thermal Compound from Fujipoly
Form-in-place thermal compound.
Carteret, NJ — Fujipoly's new SARCON® SPG-50A form-in-place gap filler material delivers a thermal conductivity of 5.0W/m°K. In addition, the new silicone-based compound exhibits ultra-low compression force making it suitable for applications that have delicate components or low compression requirements.

The form stable SPG-50A material fills large gaps around fragile circuit board solder points without causing damage or loss in performance and efficiently transfers heat from any board-level source to a nearby heat sink or heat spreader. The company's newest thermal compound will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range of -40 to +150°C).

SARCON SPG-50A is available in easy-to-use tubes or syringes.


Contact: Fujipoly America Corp., PO Box 119, Carteret, NJ 07008-0119 732-969-0100 fax: 732-969-3311 E-mail: info@fujipoly.com Web:
http://www.fujipoly.com

 
 
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