Save. Share. Connect.
Tuesday, June 28, 2016
VOLUME - NUMBER
Switches & Relays
HOME / CURRENT ISSUE
Add Message Board
Form-in-Place Thermal Compound from Fujipoly
Form-in-place thermal compound.
Carteret, NJ — Fujipoly's new SARCON
SPG-50A form-in-place gap filler material delivers a thermal conductivity of 5.0W/m°K. In addition, the new silicone-based compound exhibits ultra-low compression force making it suitable for applications that have delicate components or low compression requirements.
The form stable SPG-50A material fills large gaps around fragile circuit board solder points without causing damage or loss in performance and efficiently transfers heat from any board-level source to a nearby heat sink or heat spreader. The company's newest thermal compound will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range of -40 to +150°C).
SARCON SPG-50A is available in easy-to-use tubes or syringes.
Contact: Fujipoly America Corp., PO Box 119, Carteret, NJ 07008-0119
732-969-0100 fax: 732-969-3311 E-mail: email@example.com Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM