Thursday, May 26, 2016
VOLUME - NUMBER
Advertisements
HOME / CURRENT ISSUE >  Electronic Mfg. Products > 

SSEC Thick-Film Removal Processes to 2 Major Manufacturers
Thick-film removal system.
Horsham, PA — Solid State Equipment LLC (SSEC), a provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D-ICs), MEMS, and compound semiconductor markets, has placed its WaferStorm platform at a leading foundry in Asia as well as a major US integrated device manufacturer (IDM). In both cases, the systems were selected for their thick-film removal capabilities, which provide residue-free removal of difficult thick-film photoresists and dry films at a low cost of ownership. The WaferStorm Thick-Film Remover combines heated chemistries and proprietary soak-and-spray at high pressure for rapid and complete removal of stubborn thick-film residue. The soak step uses heated solvents throughout the buffer cycle time. After softening the thick resist in the soak, the wafers are transferred to the single-wafer spray station where they are exposed to high-pressure fan sprays with heated solvents for rapid removal of thick-film residue. This combination ensures thorough removal and increased throughput.


Contact: Solid State Equipment, LLC, 185 Gibraltar Road, Horsham, PA 19044 215-328-0700 fax: 215-328-9410 E-mail: info@ssecusa.com Web:
http://www.ssecusa.com

 
 
search login