||Marlborough, MA — Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), has introduced its SOLDERON BP TS 6000 Tin-Silver Plating Chemistry for use in lead-free solder bump plating applications. This next-generation formulation features enhanced plating performance, bath stability and ease-of-use, thereby enabling the industry's widest process window with the most robust process flexibility and a competitive cost of ownership (COO).
According to the company, as flip chip packages become mainstream and the industry continues to move toward 2.5D and 3D packaging technologies, there is a clear market requirement for high-performance lead-free alternatives for plating applications. Customers need materials optimized for today's finer bump geometries. This new chemistry achieves significant performance improvements, delivering even faster plating speeds, better uniformity and smoother surface morphology in addition to a smooth, void-free interface when used together with Dow's and other leading copper (Cu) pillar formulations.
With a single formulation, SOLDERON BP TS 6000 Tin-Silver (SnAg) is capable of plating speeds ranging from 2 to 9µm/min., which creates a significantly wider operating window when compared with other solutions in the marketplace. The tunable nature of the Ag composition in this formulation makes it suitable for a number of applications and eliminates the need to change the chemistry to address different processing requirements. The new chemistry has proven to be robust enough for both bumping and capping of a wide range of patterned wafers and it is not restricted for use with specific photoresists. It exhibits with-in die (WID) uniformity after reflow of <5 percent over a wide range of wafer types, which demonstrates its suitability for high-volume manufacturing. In addition, it is macro- and micro-void free after reflow for improved yields and reliability.
Contact: Dow Electronic Materials, 455 Forest St., Marlborough, MA 01752 800-832-6200 or 508-481-7950 Web: http://www.dow.com