DELAWARE, OH ― Engineered Material Systems (EMS), a leading global supplier of electronic materials for electronics applications, debuts its 585-1 Non-Conductive Paste (NCP) designed for flip chip packaging applications.
This new NCP is designed to provide high reliability to the gold stud bump interconnects used in flip chip packaging.
585-1 has very high fracture toughness, adhesion, is ionically clean and cures in seconds during thermal compression bonding at 200°C. It is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive, printed electronic and photonic applications.
For more information about 585-1 NCP or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.