Pyralux® flexible circuit materials enable next generation designs for
computers, hand-held devices and the infrastructure that connects the
RESEARCH TRIANGLE PARK, NC - DuPont Circuit & Packaging Materials (DuPont) will highlight DuPontT Pyralux® flexible circuit materials as part of its innovative product portfolio that enables next generation designs for computers, hand-held devices and the infrastructure that connects the cloud at DesignCon 2014 in Santa Clara, Calif., from Jan. 28-31, 2014, at booth #719. DuPont also will lead a key technical presentation during the conference in collaboration with Rogers Corporation, focused on high-frequency materials for printed circuit boards (PCBs).
"Speed requirements continue to increase while at the same time devices are smaller than ever before," said Michael J. Green, global business development manager, DuPont Circuit & Packaging Materials. "These requirements present a major challenge for designers who also must deliver highly reliable products. DuPont has been at the forefront of the flex circuit industry for over 45 years. Our products are well established where high reliability is essential and we continue to innovate to meet both current and future industry needs."
DuPontT Pyralux® flexible circuit materials offer a range of possibilities to help designers meet the market demands for high speed and reliability. Its inherent thinness enables shorter interconnect into tighter spaces. These thin connections also can free up more room in designs for additional functionality or a decrease in size of the finished assembly. In addition, the low dielectric constant and loss tangent of these materials may enable higher speeds for thin structures.
DuPont also will co-lead a workshop with Rogers Corporation on Tuesday, Jan, 28 at 1:30 PM PST as part of the DesignCon Technical program. Titled "Practical Measurements of Dielectric and Loss of PCB Materials at High Frequencies," the workshop is intended to help designers better understand the properties of low-loss materials in high-frequency applications so that they can more efficiently create designs. The workshop will include live demonstrations in which the Anritsu VectorStarT MS4640B Vector Network Analyzer (VNA) will conduct various tests on thin, flexible materials from DuPont and thick, rigid materials from Rogers Corporation to provide greater knowledge of measurements and their validity. The workshop will be presented by Glenn Oliver, senior engineer, DuPont Circuit & Packaging Materials, and John Coonrod, market development engineer, Rogers Corporation, who are the respective chair and vice-chair of the Institute of Printed Circuits (IPC) D-24C High-Frequency Test Methods Task Group.
DuPont Circuit & Packaging Materials offers a broad and growing portfolio of products including dry film photoresists and phototooling films for Printed Circuit Board (PCB) imaging, polyimide films, flexible circuit materials, embedded passive materials and thermal substrates for LED lighting. For information on DuPont circuit materials please visit our web site.