GREELEY, CO — FCT Assembly announces the launch of the NanoSlic® Gold stencil. NanoSlic® is the world’s most advanced stencil technology for solder paste printing. FCT Assembly also is pleased that NanoSlic® Gold received the 2013 NPI Award for coatings/encapsulates.
“We have capitalized on our extensive knowledge and expertise in solder paste, polymer chemistry and stencil technology to develop NanoSlic®,” said Mike Scimeca, President of FCT Assembly. “We are very excited to bring this technology to the marketplace.”
The new NanoSlic® Gold stencil is the next generation of stencil technology developed to address the increasing demands confronting the electronic assembly industry. The NanoSlic® Gold coating is based on a proprietary application process that coats both the underside of the stencil and aperture walls. This robust coating is both highly hydrophobic and oleophobic, which repels solder paste. NanoSlic® Gold is thermally cured and is a permanent coating. The NanoSlic® technology significantly improves solder paste transfer efficiencies for small apertures resulting in higher yields and less rework. In addition, NanoSlic® minimizes bridging and reduces underside cleaning. This technology can be easily evaluated and is compatible with current assembly equipment and processes.
NanoSlic® Gold coated stencils are now available and manufactured by FCT Assembly at their Memphis, Tennessee location.
FCT Assembly provides knowledge, expertise and total solutions to our solder and stencil customers. The FCT group of companies has leveraged their chemical knowledge and stencil expertise in developing this new and exciting technology. For more information, contact your local Fine Line Stencil representative to learn more about the NanoSlic® Gold coated stencil or visit www.fctassembly.com.