AYLESBURY, BUCKINGHAMSHIRE, UK — Nordson DAGE, a division of Nordson Corporation, announces the launch of its XM8000 Wafer X-ray Metrology Platform at the SEMI European 3D TSV Summit taking place in Grenoble, France 20-22 January 2014.
This new platform takes the market-leading capabilities from Nordson DAGE’s existing X-ray systems to provide an automated, high-throughput X-ray metrology and defect review system for both optically hidden and visible features of TSVs, 2.5D and 3D IC packages, MEMS and wafer bumps. The XM8000 provides unprecedented, non-destructive, in-line wafer measurement of voiding and fill levels, overlay, critical dimensions and much more. In this way the XM8000 can be used as an integral part of the fabrication and packaging of integrated circuits or as part of quality control and product acceptance.
Dr David Bernard, Business Manager Automated X-ray Systems commented, “This is an exciting launch of a major new X-ray platform for Nordson DAGE. We are taking the expertise and innovation that we have developed over many years serving the X-ray needs of electronics manufacture and now we can extend this to the necessary X-ray metrology for the ever smaller features that are used in today’s electronics such as TSVs and smaller wafer bumps.”
The XM8000 X-ray platform measures the invisible – fast – so our customers have no hidden surprises.
More information can be found at www.nordsondage.com or www.measuringtheinvisible.com