DELAWARE, OH ― Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, is pleased to debut its 535-10M-45 UV Cured Epoxy Adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications. The material contains a secondary thermal cure initiator that cures as low as 90°C for shadowed areas.
535-10M-45 is an ultra-low stress, low shrinkage, ionically clean, low glass transition temperature UV cure adhesive. The material is designed to eliminate any warpage of components in disk drive assemblies, lens bonding in camera modules, chip encapsulation in smart cards and a variety of general bonding applications in photonics assembly.
This new non-conductive UV cured adhesive cures rapidly when exposed to high intensity UV light. 535-10M-45 is a low outgassing, extremely flexible, high strength epoxy adhesive that does not contain antimony. It was developed to pass the rigorous reliability requirements in disk drive, camera module, photonics and circuit assembly applications. 535-18M-57 is the latest addition to Engineered Material Systems extensive line of electronic materials.
For more information about the 535-18M-57 UV Cure Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.